CY9AF316NABGL-GE1

Manufacturer :

Infineon Technologies

Product Category :

Microcontrollers

Operating Temperature :

-40°C~105°C TA

Number of I/O :

83

JESD-30 Code :

S-PBGA-B112

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Terminal Form :

Ball

Surface Mount :

yes

Width :

10mm

On Chip Program ROM Width :

8

DAC Channels :

No

Core Processor :

ARM® Cortex®-M3

Number of Terminations :

112

External Data Bus Width :

16

Series :

FM3 MB9A310A

Length :

10mm

Connectivity :

CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB

Core Size :

32-Bit

DMA Channels :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Clock Frequency :

48MHz

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Bit Size :

32

PWM Channels :

yes

Factory Lead Time :

20 Weeks

Has ADC :

yes

RAM Size :

32K x 8

Oscillator Type :

Internal

Program Memory Type :

Flash

Terminal Pitch :

0.8mm

Data Converter :

A/D 16x12b

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

RAM (bytes) :

32768

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Supply Voltage-Min (Vsup) :

2.7V

Mounting Type :

Surface Mount

ROM (words) :

524288

Packaging :

Tray

Address Bus Width :

25

Program Memory Size :

512KB 512K x 8

Package / Case :

112-LFBGA

Supply Voltage-Max (Vsup) :

5.5V

RoHS Status :

ROHS3 Compliant

Terminal Position :

BOTTOM

Peripherals :

DMA, LVD, POR, PWM, WDT

Height Seated (Max) :

1.45mm

Speed :

40MHz