CY9AF156NBBGL-GE1

Manufacturer :

Infineon Technologies

Product Category :

Microcontrollers

Terminal Form :

Ball

External Data Bus Width :

16

ROM (words) :

557056

Program Memory Type :

Flash

Address Bus Width :

25

Terminal Pitch :

0.8mm

Number of Terminations :

112

Bit Size :

32

Width :

10mm

Terminal Position :

BOTTOM

PWM Channels :

yes

On Chip Program ROM Width :

8

DAC Channels :

No

Has ADC :

yes

Supply Voltage-Min (Vsup) :

1.65V

RAM Size :

64K x 8

Number of I/O :

83

Mounting Type :

Surface Mount

Peripherals :

DMA, LVD, POR, PWM, WDT

Operating Temperature :

-40°C~85°C TA

Height Seated (Max) :

1.45mm

Connectivity :

CANbus, EBI/EMI, I2C, LINbus, SCI, UART/USART

Package / Case :

112-LFBGA

Data Converter :

A/D 24x12b

Length :

10mm

Oscillator Type :

Internal

JESD-30 Code :

S-PBGA-B112

Clock Frequency :

48MHz

RoHS Status :

ROHS3 Compliant

RAM (bytes) :

65536

DMA Channels :

yes

Program Memory Size :

544KB 544K x 8

Core Size :

32-Bit

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Speed :

40MHz

Voltage - Supply (Vcc/Vdd) :

1.65V~3.6V

Core Processor :

ARM® Cortex®-M3

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Packaging :

Tray

Supply Voltage-Max (Vsup) :

3.6V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Series :

FM3 MB9A150RB

Factory Lead Time :

21 Weeks

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Surface Mount :

yes