CY9AF155NBBGL-GE1

Manufacturer :

Infineon Technologies

Product Category :

Microcontrollers

Operating Temperature :

-40°C~85°C TA

Package / Case :

112-LFBGA

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

External Data Bus Width :

16

Address Bus Width :

25

Height Seated (Max) :

1.45mm

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Supply Voltage-Max (Vsup) :

3.6V

Has ADC :

yes

ROM (words) :

425984

JESD-30 Code :

S-PBGA-B112

Length :

10mm

Bit Size :

32

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Connectivity :

CANbus, EBI/EMI, I2C, LINbus, SCI, UART/USART

Packaging :

Tray

Terminal Form :

Ball

On Chip Program ROM Width :

8

Width :

10mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RAM Size :

48K x 8

PWM Channels :

yes

Terminal Pitch :

0.8mm

Surface Mount :

yes

Data Converter :

A/D 24x12b

Series :

FM3 MB9A150RB

Number of Terminations :

112

RAM (bytes) :

49152

Peripherals :

DMA, LVD, POR, PWM, WDT

Oscillator Type :

Internal

DMA Channels :

yes

Program Memory Size :

416KB 416K x 8

Mounting Type :

Surface Mount

Voltage - Supply (Vcc/Vdd) :

1.65V~3.6V

Factory Lead Time :

21 Weeks

Number of I/O :

83

RoHS Status :

ROHS3 Compliant

Core Processor :

ARM® Cortex®-M3

Supply Voltage-Min (Vsup) :

1.65V

Clock Frequency :

48MHz

Program Memory Type :

Flash

DAC Channels :

No

Core Size :

32-Bit

Speed :

40MHz

Terminal Position :

BOTTOM