CY9AF155MBBGL-GE1

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Mfr.Part #
CY9AF155MBBGL-GE1
Manufacturer
Infineon Technologies
Package / Case
96-LFBGA
Datasheet
Download
Description
IC MCU 32BIT 416KB FLASH 96FBGA
Stock
16,460
In Stock :
16,460

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Manufacturer :
Infineon Technologies
Product Category :
Microcontrollers
Bit Size :
32
RoHS Status :
ROHS3 Compliant
DMA Channels :
yes
Width :
6mm
Core Size :
32-Bit
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Core Processor :
ARM® Cortex®-M3
Address Bus Width :
21
DAC Channels :
No
RAM Size :
48K x 8
External Data Bus Width :
11
On Chip Program ROM Width :
8
Mounting Type :
Surface Mount
PWM Channels :
yes
Number of Terminations :
96
Terminal Position :
BOTTOM
ROM (words) :
425984
Factory Lead Time :
21 Weeks
Voltage - Supply (Vcc/Vdd) :
1.65V~3.6V
RAM (bytes) :
49152
Operating Temperature :
-40°C~85°C TA
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Terminal Form :
Ball
Connectivity :
CANbus, EBI/EMI, I2C, LINbus, SCI, UART/USART
Height Seated (Max) :
1.3mm
Peripherals :
DMA, LVD, POR, PWM, WDT
Supply Voltage-Min (Vsup) :
1.65V
Package / Case :
96-LFBGA
Program Memory Size :
416KB 416K x 8
Oscillator Type :
Internal
Clock Frequency :
48MHz
Has ADC :
yes
Supply Voltage-Max (Vsup) :
3.6V
Surface Mount :
yes
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Packaging :
Tray
Series :
FM3 MB9A150RB
Length :
6mm
Data Converter :
A/D 17x12b
Speed :
40MHz
Terminal Pitch :
0.5mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
66
Program Memory Type :
Flash
JESD-30 Code :
S-PBGA-B96
Datasheets
CY9AF155MBBGL-GE1
Introducing Microcontrollers Infineon Technologies CY9AF155MBBGL-GE1 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:96, Operating Temperature:-40°C~85°C TA, Package / Case:96-LFBGA, CY9AF155MBBGL-GE1 pinout, CY9AF155MBBGL-GE1 datasheet PDF, CY9AF155MBBGL-GE1 amp .Beyond Microcontrollers Infineon Technologies CY9AF155MBBGL-GE1 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY9AF155MBBGL-GE1


Microcontrollers Infineon Technologies CY9AF155MBBGL-GE1 Overview

Introducing the CY9AF155MBBGL-GE1 from Infineon Technologies, a state-of-the-art microcontroller designed for demanding applications that require robust performance and high reliability. This microcontroller is part of Infineon's powerful line of 32-bit MCUs, equipped with 416KB of flash memory, housed in a compact 96FBGA package. The CY9AF155MBBGL-GE1 is engineered to offer superior performance with advanced power management, making it ideal for integrating into energy-sensitive applications while delivering the processing power needed for complex algorithms.

CY9AF155MBBGL-GE1 Features

The CY9AF155MBBGL-GE1 microcontroller boasts numerous features that make it a prime choice for developers and engineers. These include its 32-bit processing capability, extensive 416KB flash memory for robust data management and storage, and a versatile 96FBGA package that ensures a minimal footprint on system designs. Additionally, this MCU offers enhanced interface options and improved power efficiency, making it an excellent selection for high-demand systems.

CY9AF155MBBGL-GE1 Applications

  • Automotive Systems: Utilized in engine management systems and infotainment, where its robust processing power ensures reliable performance under harsh conditions.
  • Industrial Automation: Perfect for controlling machinery and process automation, the CY9AF155MBBGL-GE1 provides the necessary computational abilities and connectivity options for complex industrial environments.
  • Smart Home Devices: Powers a variety of smart home applications, from security systems to energy management, leveraging its ability to handle multiple interfaces and sensors.
  • Healthcare Equipment: Applied in medical devices that require precise and reliable microcontrol for patient monitoring and diagnostic systems.
  • Wearable Technology: Supports advanced features in wearable devices, offering a balance of power efficiency and processing capability for next-generation wearables.
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