CY9AF154NBBGL-GE1

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Mfr.Part #
CY9AF154NBBGL-GE1
Manufacturer
Infineon Technologies
Package / Case
112-LFBGA
Datasheet
Download
Description
IC MCU 32BIT 288KB FLSH 112PFBGA
Stock
14,784
In Stock :
14,784

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Manufacturer :
Infineon Technologies
Product Category :
Microcontrollers
PWM Channels :
yes
Terminal Form :
Ball
Peripherals :
DMA, LVD, POR, PWM, WDT
Core Size :
32-Bit
Length :
10mm
Program Memory Type :
Flash
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
External Data Bus Width :
16
Core Processor :
ARM® Cortex®-M3
Voltage - Supply (Vcc/Vdd) :
1.65V~3.6V
Program Memory Size :
288KB 288K x 8
Number of Terminations :
112
RAM Size :
32K x 8
ROM (words) :
294912
Speed :
40MHz
Oscillator Type :
Internal
Supply Voltage-Min (Vsup) :
1.65V
Width :
10mm
Supply Voltage-Max (Vsup) :
3.6V
Surface Mount :
yes
Clock Frequency :
48MHz
Address Bus Width :
25
Has ADC :
yes
DAC Channels :
No
RAM (bytes) :
32768
Terminal Pitch :
0.8mm
RoHS Status :
ROHS3 Compliant
Height Seated (Max) :
1.45mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Factory Lead Time :
21 Weeks
Data Converter :
A/D 24x12b
Mounting Type :
Surface Mount
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
112-LFBGA
On Chip Program ROM Width :
8
DMA Channels :
yes
Bit Size :
32
Terminal Position :
BOTTOM
Number of I/O :
83
Connectivity :
CANbus, EBI/EMI, I2C, LINbus, SCI, UART/USART
Series :
FM3 MB9A150RB
JESD-30 Code :
S-PBGA-B112
Packaging :
Tray
Operating Temperature :
-40°C~85°C TA
Datasheets
CY9AF154NBBGL-GE1
Introducing Microcontrollers Infineon Technologies CY9AF154NBBGL-GE1 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:112, Mounting Type:Surface Mount, Package / Case:112-LFBGA, Operating Temperature:-40°C~85°C TA, CY9AF154NBBGL-GE1 pinout, CY9AF154NBBGL-GE1 datasheet PDF, CY9AF154NBBGL-GE1 amp .Beyond Microcontrollers Infineon Technologies CY9AF154NBBGL-GE1 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY9AF154NBBGL-GE1


Microcontrollers Infineon Technologies CY9AF154NBBGL-GE1 Overview

The Infineon Technologies CY9AF154NBBGL-GE1 microcontroller integrates a robust 32-bit processing core with 288KB of flash memory, encapsulated in a compact 112-PFBGA package. This high-performance microcontroller is engineered to cater to a broad range of demanding applications, offering an optimal balance of processing power, memory capacity, and energy efficiency. Ideal for developers looking to push the boundaries of IoT, industrial automation, and embedded systems, the CY9AF154NBBGL-GE1 supports complex algorithms and sophisticated interfaces, ensuring a seamless integration into your next advanced project.

CY9AF154NBBGL-GE1 Features

The CY9AF154NBBGL-GE1 from Infineon Technologies boasts an array of features that enhance its versatility and functionality in complex electronics environments. These features include a 32-bit ARM Cortex-M3 processor, which provides efficient handling of computations and algorithms. With 288KB of flash storage, it offers ample space for application code and data storage. The microcontroller's low power consumption makes it suitable for battery-operated devices, while its BGA packaging allows for a more compact board design, ideal for space-constrained applications.

CY9AF154NBBGL-GE1 Applications

  • Smart Home Devices: Utilizes its processing power to manage multiple sensor inputs and user interfaces, ensuring smooth operation and connectivity in smart home ecosystems.
  • Automotive Applications: Employs its robust processing capabilities to handle automotive control systems, including engine management and infotainment systems.
  • Industrial Automation: Perfect for controlling automated machinery and process control systems, its reliability and processing capabilities ensure maximum efficiency and uptime.
  • Wearable Technology: Its low power consumption and compact size make it ideal for wearable devices, supporting continuous health monitoring and mobile connectivity.
  • Energy Management: Helps in managing and optimizing energy consumption in systems like smart grids and renewable energy sources, contributing to more efficient energy use.
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