CY9AF115NABGL-GE1

Manufacturer :

Infineon Technologies

Product Category :

Microcontrollers

Program Memory Type :

Flash

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

JESD-30 Code :

S-PBGA-B112

RAM Size :

32K x 8

RoHS Status :

ROHS3 Compliant

Speed :

40MHz

Height Seated (Max) :

1.45mm

Operating Temperature :

-40°C~105°C TA

ROM (words) :

393216

Series :

FM3 MB9A110A

DAC Channels :

No

Packaging :

Tray

Mounting Type :

Surface Mount

Connectivity :

CANbus, EBI/EMI, I2C, LINbus, SCI, UART/USART

DMA Channels :

yes

Number of Terminations :

112

Terminal Form :

Ball

Package / Case :

112-LFBGA

Peripherals :

DMA, LVD, POR, PWM, WDT

On Chip Program ROM Width :

8

Data Converter :

A/D 16x12b

Terminal Position :

BOTTOM

Factory Lead Time :

20 Weeks

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Number of I/O :

83

Surface Mount :

yes

Has ADC :

yes

Program Memory Size :

384KB 384K x 8

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Oscillator Type :

Internal

Supply Voltage :

4.5V

Address Bus Width :

25

Bit Size :

32

RAM (bytes) :

32768

External Data Bus Width :

16

Core Processor :

ARM® Cortex®-M3

Clock Frequency :

48MHz

Core Size :

32-Bit

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Width :

10mm

Terminal Pitch :

0.8mm

Length :

10mm

Supply Voltage-Min (Vsup) :

2.7V

Supply Voltage-Max (Vsup) :

5.5V

PWM Channels :

yes

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V