CY7C4122KV13-106FCXC
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- Mfr.Part #
- CY7C4122KV13-106FCXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 361-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SRAM 144MBIT PAR 361FCBGA
- Stock
- 4
- In Stock ：
- 4
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Mounting Type :
- Surface Mount
- Memory Density :
- 150994944 bit
- Supply Voltage-Min (Vsup) :
- 1.26V
- Packaging :
- Tray
- Length :
- 21mm
- Memory Width :
- 18
- RoHS Status :
- ROHS3 Compliant
- Memory Format :
- SRAM
- Terminal Pitch :
- 1mm
- Voltage - Supply :
- 1.26V~1.34V
- Height Seated (Max) :
- 2.765mm
- Operating Temperature :
- 0°C~70°C TA
- Factory Lead Time :
- 21 Weeks
- Memory Size :
- 144Mb 8M x 18
- Number of Functions :
- 1
- Memory Interface :
- Parallel
- Organization :
- 8MX18
- Surface Mount :
- yes
- HTS Code :
- 8542.32.00.41
- Published :
- 2004
- Supply Voltage :
- 1.3V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Terminations :
- 361
- Clock Frequency :
- 1066MHz
- Memory Type :
- Volatile
- Terminal Position :
- BOTTOM
- ECCN Code :
- 3A991.B.2.A
- Width :
- 21mm
- Supply Voltage-Max (Vsup) :
- 1.34V
- Package / Case :
- 361-BBGA, FCBGA
- Number of Pins :
- 361
- Datasheets
- CY7C4122KV13-106FCXC
Memory Infineon Technologies CY7C4122KV13-106FCXC Overview
The Memory Infineon Technologies CY7C4122KV13-106FCXC represents a leading-edge solution in high-performance integrated circuits. This 144Mbit SRAM chip, housed in a 361FCBGA package, delivers robust reliability and superior speed, making it an excellent choice for advanced computing applications requiring intensive data management. Designed by Infineon Technologies, a leader in semiconductor innovation, this IC ensures high-density data storage while maintaining a compact form factor. Its parallel interface promises easy integration with existing architectures, catering to industries looking for scalable memory solutions.
CY7C4122KV13-106FCXC Features
This IC SRAM features 144Mbit of memory, which is encapsulated within a 361-pin Fine-Pitch Ball Grid Array (FCBGA) that offers enhanced thermal stability and durability under high operation frequencies. The parallel interface of the CY7C4122KV13-106FCXC facilitates higher data transfer rates and lower latency, making it ideal for performance-critical applications. Its low-power consumption and high-speed operation are critical for systems that require efficient and fast memory management.
CY7C4122KV13-106FCXC Applications
- Advanced Computing Systems: Utilized in server farms and data centers where high-speed data processing and large-scale storage capacity are necessary. The IC’s high bandwidth and storage capabilities make it perfect for these demanding environments.
- Networking Equipment: Acts as a primary component in routers and switches, providing the necessary speed and capacity for managing large volumes of network traffic effectively.
- Telecommunications Infrastructure: Supports the high-speed data requirements of telecommunications systems, including base stations and network interfaces, by ensuring reliable and quick data storage and retrieval.
- Automotive Electronics: Ideal for use in advanced driver-assistance systems (ADAS) where quick access to reliable data is crucial for real-time decision making.
- Aerospace and Defense: Meets the stringent requirements for data integrity and speed in aerospace applications, offering robust, reliable SRAM solutions for navigation and control systems.
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