CY7C2170KV18-400BZXC

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Mfr.Part #
CY7C2170KV18-400BZXC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
9
In Stock :
9

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Supply Voltage-Min (Vsup) :
1.7V
Word Size :
36b
Time@Peak Reflow Temperature-Max (s) :
30
Output Characteristics :
3-STATE
Operating Supply Voltage :
1.8V
Voltage - Supply :
1.7V~1.9V
Radiation Hardening :
No
Density :
18 Mb
Pin Count :
165
Memory Interface :
Parallel
Number of Functions :
1
Factory Lead Time :
13 Weeks
Memory Size :
18Mb 512K x 36
Operating Temperature :
0°C~70°C TA
Number of Terminations :
165
Nominal Supply Current :
640mA
Memory Width :
36
Access Time :
450 ps
Clock Frequency :
400MHz
Peak Reflow Temperature (Cel) :
260
Base Part Number :
CY7C2170
Memory Type :
Volatile
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage-Max (Vsup) :
1.9V
Address Bus Width :
18b
I/O Type :
COMMON
Number of Ports :
2
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Mounting Type :
Surface Mount
Mount :
Surface Mount
Published :
2003
Length :
15mm
Supply Voltage :
1.8V
Memory Format :
SRAM
Packaging :
Tray
RoHS Status :
ROHS3 Compliant
Sync/Async :
SYNCHRONOUS
Height Seated (Max) :
1.4mm
Number of Pins :
165
Terminal Pitch :
1mm
Package / Case :
165-LBGA
Terminal Position :
BOTTOM
JESD-609 Code :
e1
Introducing Memory Infineon Technologies CY7C2170KV18-400BZXC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Number of Terminations:165, Base Part Number:CY7C2170, Mounting Type:Surface Mount, Number of Pins:165, Package / Case:165-LBGA, CY7C2170KV18-400BZXC pinout, CY7C2170KV18-400BZXC datasheet PDF, CY7C2170KV18-400BZXC amp .Beyond Memory Infineon Technologies CY7C2170KV18-400BZXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C2170KV18-400BZXC


Memory Infineon Technologies CY7C2170KV18-400BZXC Overview

The Memory Infineon Technologies CY7C2170KV18-400BZXC is a high-performance 18Mbit SRAM module designed for demanding parallel processing applications. Manufactured by Infineon Technologies, this integrated circuit features a robust 165FBGA packaging that ensures reliable operation and high durability. With its substantial data storage capacity and fast access times, this SRAM is ideal for applications requiring rapid data retrieval and high-speed operations. This product is crafted to cater to businesses looking to enhance their systems' memory capabilities efficiently and effectively, aiming at batch purchases for optimal scalability and performance enhancement.

CY7C2170KV18-400BZXC Features

This 18Mbit SRAM IC boasts several key features, including its parallel interface, which allows for quick data access and throughput. The 165FBGA packaging not only minimizes the physical footprint but also provides enhanced thermal stability and reliability in rigorous operational conditions. This memory component is engineered for high-speed and high-density applications, making it a versatile choice for a broad range of industrial and technological uses.

CY7C2170KV18-400BZXC Applications

  • High-Speed Networking Equipment: Utilizes its fast access times and large capacity for buffering and packet storage in routers and switches.
  • Advanced Computing Systems: Supports complex computations and data-intensive applications, ensuring swift data processing and retrieval in servers and high-performance computers.
  • Telecommunication Infrastructure: Plays a crucial role in data transmission systems by managing multiple data streams efficiently, enhancing the performance of telecommunications networks.
  • Automotive Electronics: Ideal for use in automotive applications requiring rapid data access and error-free storage, such as in navigation and driver-assistance systems.
  • Industrial Automation: Enhances automation systems' capability to handle large volumes of operational data quickly and reliably, improving response times and system reliability.
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