CY7C2170KV18-400BZC

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Mfr.Part #
CY7C2170KV18-400BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
8
In Stock :
8

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Terminal Position :
BOTTOM
Number of Ports :
2
Peak Reflow Temperature (Cel) :
240
Height Seated (Max) :
1.4mm
Memory Width :
36
Address Bus Width :
18b
Terminal Pitch :
1mm
Number of Terminations :
165
Additional Feature :
PIPELINED ARCHITECTURE
Voltage - Supply :
1.7V~1.9V
Access Time :
450 ps
Number of Pins :
165
Operating Temperature :
0°C~70°C TA
Radiation Hardening :
No
Terminal Finish :
Tin/Lead (Sn/Pb)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Length :
15mm
RoHS Status :
Non-RoHS Compliant
Mounting Type :
Surface Mount
Memory Type :
Volatile
Memory Format :
SRAM
Supply Voltage :
1.8V
Supply Voltage-Max (Vsup) :
1.9V
Supply Voltage-Min (Vsup) :
1.7V
Clock Frequency :
400MHz
Packaging :
Tray
Base Part Number :
CY7C2170
Time@Peak Reflow Temperature-Max (s) :
30
JESD-609 Code :
e0
Memory Interface :
Parallel
Number of Functions :
1
Published :
2003
Operating Supply Voltage :
1.8V
Surface Mount :
yes
Density :
18 Mb
Package / Case :
165-LBGA
Memory Size :
18Mb 512K x 36
Introducing Memory Infineon Technologies CY7C2170KV18-400BZC from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:165, Number of Pins:165, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Base Part Number:CY7C2170, Package / Case:165-LBGA, CY7C2170KV18-400BZC pinout, CY7C2170KV18-400BZC datasheet PDF, CY7C2170KV18-400BZC amp .Beyond Memory Infineon Technologies CY7C2170KV18-400BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C2170KV18-400BZC


Memory Infineon Technologies CY7C2170KV18-400BZC Overview

The Memory Infineon Technologies CY7C2170KV18-400BZC, an 18Mbit SRAM component manufactured by Infineon Technologies, stands out in the market for its robust performance and reliability. Designed for high-speed, parallel interfacing, this IC SRAM is packaged in a compact 165FBGA, ensuring efficient space utilization and thermal management. With its significant storage capacity and the ability to sustain high-speed data transactions, the CY7C2170KV18-400BZC is an ideal solution for applications demanding rapid access to large volumes of data. Its design and functionality make it highly suitable for advanced computing systems and embedded applications where speed and space economy are critical.

CY7C2170KV18-400BZC Features

This SRAM chip features 18Mbit of storage, providing ample space for high-performance computing tasks. The parallel interface facilitates fast data transfer rates, which is crucial for systems requiring quick read and write operations. The compact 165FBGA package allows for efficient layout in space-constrained applications while maintaining excellent thermal properties and signal integrity.

CY7C2170KV18-400BZC Applications

  • Networking Equipment: Used in routers, switches, and other networking hardware to buffer data during peak loads, ensuring smooth data flow and system stability.
  • High-performance Computing: Acts as temporary storage for fast-access data in supercomputers and high-performance servers, enhancing processing speeds and reliability.
  • Automotive Electronics: Integrated into automotive systems for advanced driver-assistance systems (ADAS), where quick data retrieval is critical for real-time decision making.
  • Industrial Automation: Utilized in PLCs and other control systems to manage operational data quickly and reliably, enhancing overall process efficiency.
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