CY7C2170KV18-400BZC
- Mfr.Part #
- CY7C2170KV18-400BZC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165FBGA
- Stock
- 8
- In Stock :
- 8
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Terminal Position :
- BOTTOM
- Number of Ports :
- 2
- Peak Reflow Temperature (Cel) :
- 240
- Height Seated (Max) :
- 1.4mm
- Memory Width :
- 36
- Address Bus Width :
- 18b
- Terminal Pitch :
- 1mm
- Number of Terminations :
- 165
- Additional Feature :
- PIPELINED ARCHITECTURE
- Voltage - Supply :
- 1.7V~1.9V
- Access Time :
- 450 ps
- Number of Pins :
- 165
- Operating Temperature :
- 0°C~70°C TA
- Radiation Hardening :
- No
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Length :
- 15mm
- RoHS Status :
- Non-RoHS Compliant
- Mounting Type :
- Surface Mount
- Memory Type :
- Volatile
- Memory Format :
- SRAM
- Supply Voltage :
- 1.8V
- Supply Voltage-Max (Vsup) :
- 1.9V
- Supply Voltage-Min (Vsup) :
- 1.7V
- Clock Frequency :
- 400MHz
- Packaging :
- Tray
- Base Part Number :
- CY7C2170
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-609 Code :
- e0
- Memory Interface :
- Parallel
- Number of Functions :
- 1
- Published :
- 2003
- Operating Supply Voltage :
- 1.8V
- Surface Mount :
- yes
- Density :
- 18 Mb
- Package / Case :
- 165-LBGA
- Memory Size :
- 18Mb 512K x 36
- Datasheets
- CY7C2170KV18-400BZC

Memory Infineon Technologies CY7C2170KV18-400BZC Overview
The Memory Infineon Technologies CY7C2170KV18-400BZC, an 18Mbit SRAM component manufactured by Infineon Technologies, stands out in the market for its robust performance and reliability. Designed for high-speed, parallel interfacing, this IC SRAM is packaged in a compact 165FBGA, ensuring efficient space utilization and thermal management. With its significant storage capacity and the ability to sustain high-speed data transactions, the CY7C2170KV18-400BZC is an ideal solution for applications demanding rapid access to large volumes of data. Its design and functionality make it highly suitable for advanced computing systems and embedded applications where speed and space economy are critical.
CY7C2170KV18-400BZC Features
This SRAM chip features 18Mbit of storage, providing ample space for high-performance computing tasks. The parallel interface facilitates fast data transfer rates, which is crucial for systems requiring quick read and write operations. The compact 165FBGA package allows for efficient layout in space-constrained applications while maintaining excellent thermal properties and signal integrity.
CY7C2170KV18-400BZC Applications
- Networking Equipment: Used in routers, switches, and other networking hardware to buffer data during peak loads, ensuring smooth data flow and system stability.
- High-performance Computing: Acts as temporary storage for fast-access data in supercomputers and high-performance servers, enhancing processing speeds and reliability.
- Automotive Electronics: Integrated into automotive systems for advanced driver-assistance systems (ADAS), where quick data retrieval is critical for real-time decision making.
- Industrial Automation: Utilized in PLCs and other control systems to manage operational data quickly and reliably, enhancing overall process efficiency.
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