CY7C2165KV18-550BZC
- Mfr.Part #
- CY7C2165KV18-550BZC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165FBGA
- Stock
- 22,174
- In Stock :
- 22,174
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Factory Lead Time :
- 13 Weeks
- Address Bus Width :
- 17b
- Operating Supply Voltage :
- 1.8V
- Peak Reflow Temperature (Cel) :
- 235
- Memory Size :
- 18Mb 512K x 36
- Density :
- 18 Mb
- Number of Functions :
- 1
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Output Characteristics :
- 3-STATE
- Supply Voltage-Min (Vsup) :
- 1.7V
- Operating Temperature :
- 0°C~70°C TA
- Radiation Hardening :
- No
- Additional Feature :
- PIPELINED ARCHITECTURE
- Memory Width :
- 36
- Pin Count :
- 165
- Terminal Position :
- BOTTOM
- Base Part Number :
- CY7C2165
- Number of Terminations :
- 165
- Clock Frequency :
- 550MHz
- Standby Current-Max :
- 0.34A
- Memory Format :
- SRAM
- Memory Type :
- Volatile
- Supply Voltage :
- 1.8V
- Sync/Async :
- SYNCHRONOUS
- JESD-609 Code :
- e0
- Memory Interface :
- Parallel
- Supply Voltage-Max (Vsup) :
- 1.9V
- Height Seated (Max) :
- 1.4mm
- RoHS Status :
- Non-RoHS Compliant
- Standby Voltage-Min :
- 1.7V
- Terminal Pitch :
- 1mm
- Access Time :
- 450 ps
- Voltage - Supply :
- 1.7V~1.9V
- Nominal Supply Current :
- 1.1A
- I/O Type :
- Separate
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Published :
- 2003
- Word Size :
- 36b
- Length :
- 15mm
- Packaging :
- Tray
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Number of Pins :
- 165
- Mount :
- Surface Mount
- Package / Case :
- 165-LBGA
- Mounting Type :
- Surface Mount
- Number of Ports :
- 2
- Datasheets
- CY7C2165KV18-550BZC

Memory Infineon Technologies CY7C2165KV18-550BZC Overview
The Infineon Technologies CY7C2165KV18-550BZC is a cutting-edge 18Mbit SRAM chip, offering robust high-speed performance encapsulated in a compact 165FBGA package. Designed to meet the demanding requirements of sophisticated electronics, this memory module is engineered for applications requiring rapid access and high reliability. The 18Mbit density provides substantial space for critical data without compromising on the speed, thanks to its parallel interface. With its advanced technical specifications and commitment to reliability, the Memory Infineon Technologies CY7C2165KV18-550BZC stands as an ideal choice for businesses looking to enhance their systems with high-performance memory solutions.
CY7C2165KV18-550BZC Features
This SRAM component boasts a dense 18Mbit memory capacity with a fast access time, housed in a space-efficient 165FBGA package. The parallel interface ensures compatibility with a broad range of high-speed computing systems and is particularly suited for applications that require quick data retrieval and high throughput.
CY7C2165KV18-550BZC Applications
- Networking Equipment: Used in routers and switches for packet buffering and data storage, facilitating efficient data flow and management.
- Telecommunications: Integral for telecom infrastructures, where rapid access to buffer memory is critical for handling high-speed communications and real-time data processing.
- High-performance Computing: Supports servers and supercomputers where high-speed memory is essential for processing large datasets and performing complex computations quickly.
- Automotive Electronics: Utilized in advanced driver-assistance systems (ADAS) to quickly process and store sensor data, enhancing vehicle safety and performance.
- Industrial Automation: Critical for control systems in manufacturing environments, where quick data access is necessary for real-time process control and monitoring.
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