CY7C1911KV18-300BZCT

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Mfr.Part #
CY7C1911KV18-300BZCT
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
13,397
In Stock :
13,397

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Radiation Hardening :
No
Memory Format :
SRAM
Package / Case :
165-LBGA
RoHS Status :
Non-RoHS Compliant
Memory Size :
18Mb 2M x 9
Supply Voltage-Max (Vsup) :
1.9V
Address Bus Width :
19b
Terminal Finish :
Tin/Lead (Sn/Pb)
Length :
15mm
Operating Temperature :
0°C~70°C TA
Terminal Position :
BOTTOM
Mounting Type :
Surface Mount
Memory Interface :
Parallel
JESD-609 Code :
e0
I/O Type :
Separate
Number of Terminations :
165
Surface Mount :
yes
Voltage - Supply :
1.7V~1.9V
Packaging :
Tape and Reel (TR)
Density :
18 Mb
Additional Feature :
PIPELINED ARCHITECTURE
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Functions :
1
Output Characteristics :
3-STATE
Factory Lead Time :
15 Weeks
Published :
2003
Memory Type :
Volatile
Operating Supply Voltage :
1.8V
Clock Frequency :
300MHz
Terminal Pitch :
1mm
Supply Voltage-Min (Vsup) :
1.7V
Standby Voltage-Min :
1.7V
Supply Voltage :
1.8V
Number of Ports :
2
Pbfree Code :
No
Memory Width :
9
Height Seated (Max) :
1.4mm
Access Time :
450 ps
Peak Reflow Temperature (Cel) :
220
Supply Current-Max :
0.49mA
Number of Pins :
165
Introducing Memory Infineon Technologies CY7C1911KV18-300BZCT from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Number of Terminations:165, Number of Pins:165, CY7C1911KV18-300BZCT pinout, CY7C1911KV18-300BZCT datasheet PDF, CY7C1911KV18-300BZCT amp .Beyond Memory Infineon Technologies CY7C1911KV18-300BZCT ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1911KV18-300BZCT


Memory Infineon Technologies CY7C1911KV18-300BZCT Overview

Designed to meet the high-speed, high-density requirements of today's sophisticated electronic environments, the Memory Infineon Technologies CY7C1911KV18-300BZCT IC SRAM integrates advanced 18Mbit memory capacity within a compact 165FBGA package. This product by Infineon Technologies ensures robust performance for data-intensive applications, offering a seamless interface for parallel processing tasks. Its superior design is tailored to enhance the operational efficiency of systems requiring fast access and substantial data buffering in industrial applications. By incorporating this memory module into your solutions, enterprises can significantly reduce system latencies and boost overall reliability and responsiveness.

CY7C1911KV18-300BZCT Features

The CY7C1911KV18-300BZCT from Infineon Technologies is characterized by a variety of features that make it a prime choice for demanding applications, including a large 18MBit storage capacity and a parallel interface for high-speed data transmission. The compact 165FBGA package ensures minimal space usage while providing substantial data management capabilities, making it an efficient solution for tight system integrations.

CY7C1911KV18-300BZCT Applications

  • Networking Equipment: Utilized in routers and switches to manage buffer memory requirements, facilitating rapid data packet storage and retrieval critical for maintaining high-speed network communications.
  • Telecommunications Systems: Serves as a high-capacity memory solution in telecom infrastructure, supporting the handling of large volumes of data and contributing to enhanced service delivery and reliability.
  • Industrial Automation: Deployed in control systems where quick access to data is necessary for real-time process control, improving operational accuracy and machine response times.
  • Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to store and manage sensor data, crucial for real-time decision-making and vehicle safety enhancements.
  • Consumer Electronics: Ideal for high-performance gaming consoles and computers, where it supports intensive data processing and enhances user experience with reduced latency in graphic rendering and data loading.
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Shipping Cost

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