CY7C1911KV18-300BZC

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Mfr.Part #
CY7C1911KV18-300BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
33
In Stock :
33

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Number of Terminations :
165
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
Non-RoHS Compliant
Clock Frequency :
300MHz
Voltage - Supply :
1.7V~1.9V
Packaging :
Tape and Reel (TR)
Standby Voltage-Min :
1.7V
Number of Pins :
165
Terminal Position :
BOTTOM
Terminal Finish :
Tin/Lead (Sn/Pb)
Supply Voltage-Min (Vsup) :
1.7V
Memory Format :
SRAM
Supply Voltage :
1.8V
Published :
2003
Memory Width :
9
Density :
18 Mb
Factory Lead Time :
15 Weeks
Memory Size :
18Mb 2M x 9
Supply Voltage-Max (Vsup) :
1.9V
Pbfree Code :
No
Additional Feature :
PIPELINED ARCHITECTURE
Peak Reflow Temperature (Cel) :
220
Output Characteristics :
3-STATE
Memory Type :
Volatile
Number of Functions :
1
Surface Mount :
yes
Operating Temperature :
0°C~70°C TA
Operating Supply Voltage :
1.8V
Number of Ports :
2
Mounting Type :
Surface Mount
Supply Current-Max :
0.49mA
Memory Interface :
Parallel
Terminal Pitch :
1mm
Access Time :
450 ps
I/O Type :
Separate
JESD-609 Code :
e0
Length :
15mm
Height Seated (Max) :
1.4mm
Address Bus Width :
19b
Radiation Hardening :
No
Package / Case :
165-LBGA
Introducing Memory Infineon Technologies CY7C1911KV18-300BZC from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:165, Number of Pins:165, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Package / Case:165-LBGA, CY7C1911KV18-300BZC pinout, CY7C1911KV18-300BZC datasheet PDF, CY7C1911KV18-300BZC amp .Beyond Memory Infineon Technologies CY7C1911KV18-300BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1911KV18-300BZC


Memory Infineon Technologies CY7C1911KV18-300BZC Overview

Introducing the Memory Infineon Technologies CY7C1911KV18-300BZC, a high-performance 18Mbit SRAM chip designed for demanding applications that require rapid access to large volumes of data. Manufactured by Infineon Technologies, this integrated circuit is encapsulated in a 165FBGA package, ensuring robustness and durability in a compact form factor. Its high-speed interface and parallel data access capabilities make it an excellent choice for systems that cannot tolerate latency, providing reliable and efficient performance in critical environments. The utilization of advanced fabrication technology allows this SRAM to achieve reduced power consumption and enhanced data integrity, making it a superior selection for developers and engineers aiming to optimize their hardware solutions.

CY7C1911KV18-300BZC Features

This SRAM device boasts several key features that make it stand out in the competitive field of memory technology. It supports a parallel interface for quick data access and manipulation, and is designed to operate at a speed of 300 MHz, providing swift throughput for high-speed computing tasks. Additionally, its 165FBGA packaging is not only space-efficient but also aids in optimal thermal management, thereby maintaining system stability under high operational loads.

CY7C1911KV18-300BZC Applications

  • Networking Equipment: Used in routers and switches, the CY7C1911KV18-300BZC facilitates fast packet buffering to enhance internet speed and manage high traffic efficiently.
  • High-Performance Computing: Integral for workstations and servers requiring rapid access to temporary data, improving processing times and reliability under demanding applications.
  • Automotive Electronics: Supports advanced driver-assistance systems (ADAS) by storing critical data needed for real-time decision making, thus enhancing vehicle safety and performance.
  • Industrial Automation: Ideal for PLCs and control systems where fast data retrieval is necessary for managing complex machinery and production processes.
  • Consumer Electronics: Utilized in high-end gaming consoles and virtual reality systems, providing the necessary speed and capacity to handle intense graphic and audio processing.
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