CY7C1911JV18-300BZC
- Mfr.Part #
- CY7C1911JV18-300BZC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165FBGA
- Stock
- 157
- In Stock :
- 157
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Terminal Pitch :
- 1mm
- Memory Width :
- 9
- Length :
- 15mm
- Qualification Status :
- COMMERCIAL
- Memory Density :
- 18874368 bit
- Clock Frequency :
- 300MHz
- Voltage - Supply :
- 1.7V~1.9V
- Terminal Position :
- BOTTOM
- RoHS Status :
- Non-RoHS Compliant
- Memory Type :
- Volatile
- Number of Functions :
- 1
- Packaging :
- Tray
- Memory Format :
- SRAM
- Surface Mount :
- yes
- Organization :
- 2MX9
- Access Time (Max) :
- 0.45 ns
- Package / Case :
- 165-LBGA
- Mounting Type :
- Surface Mount
- JESD-30 Code :
- R-PBGA-B165
- Supply Voltage-Min (Vsup) :
- 1.7V
- Pin Count :
- 165
- Operating Temperature :
- 0°C~70°C TA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Interface :
- Parallel
- Reach Compliance Code :
- Unknown
- Additional Feature :
- PIPELINED ARCHITECTURE
- Number of Terminations :
- 165
- Supply Voltage :
- 1.8V
- Width :
- 13mm
- Height Seated (Max) :
- 1.4mm
- Supply Voltage-Max (Vsup) :
- 1.9V
- Memory Size :
- 18Mb 2M x 9
- Datasheets
- CY7C1911JV18-300BZC

Memory Infineon Technologies CY7C1911JV18-300BZC Overview
The Memory Infineon Technologies CY7C1911JV18-300BZC represents a cutting-edge solution in integrated circuit technology, providing an impressive 18Mbit of SRAM in a compact 165FBGA package. Manufactured by Infineon Technologies, this high-performance IC is designed to meet the demanding needs of modern electronic systems, offering fast access times and high data integrity. This memory module is ideal for applications requiring high-speed data retrieval and storage without compromising on reliability and efficiency. Its robust design and advanced manufacturing techniques ensure optimal performance in a variety of challenging environments.
CY7C1911JV18-300BZC Features
The CY7C1911JV18-300BZC IC SRAM boasts several distinctive features that make it a top choice for high-demand applications. These include its large 18Mbit capacity, high-speed parallel interface, and the compact 165FBGA packaging which allows for efficient use of board space and easier integration into existing designs. Additionally, its durability and reliability are enhanced by Infineon's leading-edge fabrication processes, ensuring that the device operates effectively under a broad range of environmental conditions.
CY7C1911JV18-300BZC Applications
- Telecommunications Equipment: Utilized for buffering and high-speed data caching, enabling enhanced performance and reliability in communication hardware.
- Industrial Automation Systems: Acts as a reliable data storage solution within control units, facilitating rapid access to operational parameters and ensuring smooth process management.
- Automotive Electronics: Applied in advanced driver-assistance systems (ADAS) to store critical data, contributing to improved vehicle safety and performance.
- Networking Hardware: Employs high-speed memory for managing router and switch configurations, improving data throughput and network reliability.
- Consumer Electronics: Integral in devices such as high-definition televisions and gaming consoles, where high data bandwidth and low latency are crucial for performance.
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