CY7C1911JV18-300BZC

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Mfr.Part #
CY7C1911JV18-300BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
157
In Stock :
157

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Terminal Pitch :
1mm
Memory Width :
9
Length :
15mm
Qualification Status :
COMMERCIAL
Memory Density :
18874368 bit
Clock Frequency :
300MHz
Voltage - Supply :
1.7V~1.9V
Terminal Position :
BOTTOM
RoHS Status :
Non-RoHS Compliant
Memory Type :
Volatile
Number of Functions :
1
Packaging :
Tray
Memory Format :
SRAM
Surface Mount :
yes
Organization :
2MX9
Access Time (Max) :
0.45 ns
Package / Case :
165-LBGA
Mounting Type :
Surface Mount
JESD-30 Code :
R-PBGA-B165
Supply Voltage-Min (Vsup) :
1.7V
Pin Count :
165
Operating Temperature :
0°C~70°C TA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Interface :
Parallel
Reach Compliance Code :
Unknown
Additional Feature :
PIPELINED ARCHITECTURE
Number of Terminations :
165
Supply Voltage :
1.8V
Width :
13mm
Height Seated (Max) :
1.4mm
Supply Voltage-Max (Vsup) :
1.9V
Memory Size :
18Mb 2M x 9
Introducing Memory Infineon Technologies CY7C1911JV18-300BZC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Number of Terminations:165, CY7C1911JV18-300BZC pinout, CY7C1911JV18-300BZC datasheet PDF, CY7C1911JV18-300BZC amp .Beyond Memory Infineon Technologies CY7C1911JV18-300BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1911JV18-300BZC


Memory Infineon Technologies CY7C1911JV18-300BZC Overview

The Memory Infineon Technologies CY7C1911JV18-300BZC represents a cutting-edge solution in integrated circuit technology, providing an impressive 18Mbit of SRAM in a compact 165FBGA package. Manufactured by Infineon Technologies, this high-performance IC is designed to meet the demanding needs of modern electronic systems, offering fast access times and high data integrity. This memory module is ideal for applications requiring high-speed data retrieval and storage without compromising on reliability and efficiency. Its robust design and advanced manufacturing techniques ensure optimal performance in a variety of challenging environments.

CY7C1911JV18-300BZC Features

The CY7C1911JV18-300BZC IC SRAM boasts several distinctive features that make it a top choice for high-demand applications. These include its large 18Mbit capacity, high-speed parallel interface, and the compact 165FBGA packaging which allows for efficient use of board space and easier integration into existing designs. Additionally, its durability and reliability are enhanced by Infineon's leading-edge fabrication processes, ensuring that the device operates effectively under a broad range of environmental conditions.

CY7C1911JV18-300BZC Applications

  • Telecommunications Equipment: Utilized for buffering and high-speed data caching, enabling enhanced performance and reliability in communication hardware.
  • Industrial Automation Systems: Acts as a reliable data storage solution within control units, facilitating rapid access to operational parameters and ensuring smooth process management.
  • Automotive Electronics: Applied in advanced driver-assistance systems (ADAS) to store critical data, contributing to improved vehicle safety and performance.
  • Networking Hardware: Employs high-speed memory for managing router and switch configurations, improving data throughput and network reliability.
  • Consumer Electronics: Integral in devices such as high-definition televisions and gaming consoles, where high data bandwidth and low latency are crucial for performance.
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Shipping Method

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Shipping Cost

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