CY7C1570V18-400BZXC
- Mfr.Part #
- CY7C1570V18-400BZXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 72MBIT PARALLEL 165FBGA
- Stock
- 5,546
- In Stock :
- 5,546
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Memory Type :
- Volatile
- RoHS Status :
- ROHS3 Compliant
- Published :
- 2003
- Peak Reflow Temperature (Cel) :
- 260
- Memory Interface :
- Parallel
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Number of Pins :
- 165
- Power Supplies :
- 1.5/1.81.8V
- Height Seated (Max) :
- 1.4mm
- Number of Terminations :
- 165
- I/O Type :
- COMMON
- Memory Density :
- 75497472 bit
- Standby Voltage-Min :
- 1.7V
- Surface Mount :
- yes
- Operating Temperature :
- 0°C~70°C TA
- Output Characteristics :
- 3-STATE
- Access Time :
- 450 ps
- ECCN Code :
- 3A991.B.2.A
- Base Part Number :
- CY7C1570
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Mounting Type :
- Surface Mount
- JESD-609 Code :
- e1
- Memory Width :
- 36
- Memory Format :
- SRAM
- Terminal Pitch :
- 1mm
- HTS Code :
- 8542.32.00.41
- Voltage - Supply :
- 1.7V~1.9V
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Organization :
- 2MX36
- Reach Compliance Code :
- Unknown
- Pin Count :
- 165
- Supply Voltage-Max (Vsup) :
- 1.9V
- Package / Case :
- 165-LBGA
- Supply Voltage-Min (Vsup) :
- 1.7V
- Number of Functions :
- 1
- Clock Frequency :
- 400MHz
- Additional Feature :
- PIPELINED ARCHITECTURE
- Packaging :
- Tray
- Length :
- 17mm
- Width :
- 15mm
- Supply Voltage :
- 1.8V
- Terminal Position :
- BOTTOM
- Memory Size :
- 72Mb 2M x 36
- Supply Current-Max :
- 1.4mA
- Qualification Status :
- Not Qualified
- Datasheets
- CY7C1570V18-400BZXC

Memory Infineon Technologies CY7C1570V18-400BZXC Overview
The Memory Infineon Technologies CY7C1570V18-400BZXC is a high-performance IC SRAM product from Infineon Technologies, designed to meet the rigorous demands of advanced computing systems. Boasting a substantial 72Mbit capacity, this SRAM chip is housed in a compact 165FBGA package, ensuring efficient space utilization on PCBs. Its fast access time, supported by a 400 MHz clock speed, makes it an excellent choice for applications requiring quick data retrieval and high bandwidth. The use of leading-edge technology in the CY7C1570V18-400BZXC not only enhances system reliability but also improves power efficiency, making it a pivotal component in modern electronic designs.
CY7C1570V18-400BZXC Features
This IC SRAM chip offers several features that make it standout in the Memory segment. Key features include:
- 72Mbit High-Density Memory: Large capacity for storing substantial amounts of data.
- 400 MHz Clock Speed: Fast processing capabilities allow for high-speed operations.
- Parallel Interface: Enables quick and easy integration into existing architectures.
- 165FBGA Package: Compact footprint for optimized space management on circuit boards.
CY7C1570V18-400BZXC Applications
- Networking Equipment: Utilizes the high-speed memory for managing routing tables and buffering data in switches and routers.
- High-Performance Computing: Supports the intense processing demands of supercomputers and data centers by facilitating rapid access to frequently used data.
- Telecommunications: Helps in handling large volumes of information, improving efficiency in telecommunications infrastructure.
- Gaming Consoles: Enhances gaming experience by reducing load times and smoothing gameplay through fast data retrieval.
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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
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