CY7C1563V18-400BZC

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Mfr.Part #
CY7C1563V18-400BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 72MBIT PARALLEL 165FBGA
Stock
4,128
In Stock :
4,128

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Interface :
Parallel
Pin Count :
165
Height Seated (Max) :
1.4mm
Peak Reflow Temperature (Cel) :
220
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Memory Width :
18
Additional Feature :
PIPELINED ARCHITECTURE
Lead Free :
Contains Lead
Terminal Finish :
Tin/Lead (Sn/Pb)
Number of Functions :
1
Number of Terminations :
165
Output Characteristics :
3-STATE
Voltage - Supply :
1.7V~1.9V
Memory Size :
72Mb 4M x 18
Supply Voltage-Min (Vsup) :
1.7V
HTS Code :
8542.32.00.41
Surface Mount :
yes
Packaging :
Tray
ECCN Code :
3A991.B.2.A
Operating Supply Voltage :
1.8V
JESD-609 Code :
e0
Terminal Pitch :
1mm
Organization :
4MX18
Package / Case :
165-LBGA
Length :
17mm
Operating Temperature :
0°C~70°C TA
Base Part Number :
CY7C1563
Number of Pins :
165
Density :
72 Mb
Memory Type :
Volatile
Supply Current-Max :
1.4mA
Clock Frequency :
400MHz
Supply Voltage-Max (Vsup) :
1.9V
Supply Voltage :
1.8V
Mounting Type :
Surface Mount
Standby Voltage-Min :
1.7V
I/O Type :
Separate
Published :
2003
Qualification Status :
Not Qualified
Width :
15mm
Memory Format :
SRAM
Standby Current-Max :
0.55A
RoHS Status :
Non-RoHS Compliant
Reach Compliance Code :
not_compliant
Terminal Position :
BOTTOM
Access Time :
450 ps
Introducing Memory Infineon Technologies CY7C1563V18-400BZC from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:165, Package / Case:165-LBGA, Operating Temperature:0°C~70°C TA, Base Part Number:CY7C1563, Number of Pins:165, Mounting Type:Surface Mount, CY7C1563V18-400BZC pinout, CY7C1563V18-400BZC datasheet PDF, CY7C1563V18-400BZC amp .Beyond Memory Infineon Technologies CY7C1563V18-400BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1563V18-400BZC


Memory Infineon Technologies CY7C1563V18-400BZC Overview

The Memory Infineon Technologies CY7C1563V18-400BZC is a high-performance, 72Mbit SRAM device designed for advanced, high-speed computing and data processing systems. Manufactured by Infineon Technologies, this memory module utilizes a parallel interface and is encased in a compact 165FBGA package. It is engineered to meet the demanding requirements of bandwidth-intensive applications, providing robust, reliable storage solutions that enhance system efficiency and performance. This product is ideal for businesses seeking powerful and scalable memory options for their advanced hardware setups.

CY7C1563V18-400BZC Features

This SRAM module boasts several key features that make it a standout choice for system designers and engineers. It offers a large storage capacity of 72Mbit, combined with a high-speed access rate facilitated by its 400 MHz clock speed. The device's parallel interface ensures rapid data transfer rates, which is crucial for applications requiring fast read/write operations. The 165FBGA packaging not only minimizes space usage but also aids in efficient thermal management, enhancing the module's reliability and lifespan under continuous operation.

CY7C1563V18-400BZC Applications

  • Networking Equipment: Utilized in routers and switches, where high-speed, reliable memory is crucial for managing large volumes of data and maintaining fast network communications.
  • High-Performance Computing (HPC): Supports the needs of supercomputing systems that require rapid access to large amounts of data for complex computations and processing tasks.
  • Automotive Electronics: Used in advanced driver-assistance systems (ADAS) where quick data processing is essential for real-time decision making.
  • Industrial Automation: Enhances the capability of industrial control systems which require robust, high-speed memory for managing operational data and ensuring system stability and efficiency.
  • Telecommunications: Plays a critical role in telecommunications infrastructure, providing the memory capacity needed for high-speed data processing and transmission.
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