CY7C1550V18-375BZC

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Mfr.Part #
CY7C1550V18-375BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 72MBIT PARALLEL 165FBGA
Stock
13,409
In Stock :
13,409

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Pin Count :
165
I/O Type :
COMMON
Lead Free :
Contains Lead
Number of Pins :
165
Power Supplies :
1.5/1.81.8V
Surface Mount :
yes
Memory Type :
Volatile
Density :
72 Mb
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Published :
2003
Number of Terminations :
165
Mounting Type :
Surface Mount
Terminal Position :
BOTTOM
Packaging :
Tray
HTS Code :
8542.32.00.41
Terminal Finish :
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Memory Format :
SRAM
Terminal Pitch :
1mm
Reach Compliance Code :
not_compliant
Memory Width :
36
ECCN Code :
3A991.B.2.A
Qualification Status :
Not Qualified
Standby Current-Max :
0.525A
Height Seated (Max) :
1.4mm
Supply Voltage-Max (Vsup) :
1.9V
Peak Reflow Temperature (Cel) :
220
Access Time :
450 ps
Length :
17mm
Operating Temperature :
0°C~70°C TA
Memory Interface :
Parallel
RoHS Status :
Non-RoHS Compliant
Standby Voltage-Min :
1.7V
Supply Current-Max :
1.3mA
Memory Size :
72Mb 2M x 36
JESD-609 Code :
e0
Clock Frequency :
375MHz
Base Part Number :
CY7C1550
Additional Feature :
PIPELINED ARCHITECTURE
Width :
15mm
Organization :
2MX36
Number of Functions :
1
Package / Case :
165-LBGA
Supply Voltage-Min (Vsup) :
1.7V
Voltage - Supply :
1.7V~1.9V
Supply Voltage :
1.8V
Output Characteristics :
3-STATE
Introducing Memory Infineon Technologies CY7C1550V18-375BZC from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:165, Number of Terminations:165, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Base Part Number:CY7C1550, Package / Case:165-LBGA, CY7C1550V18-375BZC pinout, CY7C1550V18-375BZC datasheet PDF, CY7C1550V18-375BZC amp .Beyond Memory Infineon Technologies CY7C1550V18-375BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1550V18-375BZC


Memory Infineon Technologies CY7C1550V18-375BZC Overview

The Memory Infineon Technologies CY7C1550V18-375BZC is a high-performance SRAM chip designed for applications requiring rapid access to large volumes of data. Manufactured by Infineon Technologies, this integrated circuit features a 72Mbit capacity and utilizes a parallel interface, encapsulated in a compact 165FBGA package. Its high-speed operation at 375 MHz makes it an ideal choice for demanding digital systems where speed and reliability are paramount. With its robust data integrity and storage efficiency, the CY7C1550V18-375BZC is engineered to meet the critical needs of advanced computing and high-speed processing devices.

CY7C1550V18-375BZC Features

This IC SRAM offers several standout features that make it particularly suitable for high-performance applications:

  • 72Mbit high-density memory for extensive data storage
  • Parallel interface ensuring rapid data access and throughput
  • Operating frequency of 375 MHz enabling quick response times
  • Compact 165FBGA packaging for efficient use of board space
  • Designed for high reliability and durability under intense operational conditions

CY7C1550V18-375BZC Applications

  • Networking Equipment: Utilized in routers and switches to enhance buffering and caching functions, supporting high-speed network performance and reliability.
  • Telecommunications: Critical for use in telecom infrastructures, such as signal processing equipment where rapid data access is necessary for real-time communication services.
  • High-Performance Computing: Serves as fast-access, temporary storage in supercomputers and high-performance servers, facilitating complex calculations and data processing tasks.
  • Industrial Automation: Integrated in control systems requiring quick data retrieval to ensure seamless process control and operational efficiency.
  • Aerospace and Defense: Deployed in systems that require robust memory solutions capable of withstanding extreme environmental conditions and providing reliable performance.
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