CY7C1515V18-200BZC
- Mfr.Part #
- CY7C1515V18-200BZC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 72MBIT PARALLEL 165FBGA
- Stock
- 95
- In Stock :
- 95
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Density :
- 72 Mb
- Height Seated (Max) :
- 1.4mm
- Peak Reflow Temperature (Cel) :
- 220
- Base Part Number :
- CY7C1515
- Address Bus Width :
- 19b
- Number of Ports :
- 2
- Number of Terminations :
- 165
- Terminal Position :
- BOTTOM
- Number of Pins :
- 165
- Supply Voltage-Max (Vsup) :
- 1.9V
- Package / Case :
- 165-LBGA
- Access Time :
- 450 ps
- Memory Type :
- Volatile
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Reach Compliance Code :
- not_compliant
- Operating Temperature :
- 0°C~70°C TA
- Mount :
- Surface Mount
- Voltage - Supply :
- 1.7V~1.9V
- Supply Voltage-Min (Vsup) :
- 1.7V
- Terminal Pitch :
- 1mm
- Number of Functions :
- 1
- Packaging :
- Tray
- Word Size :
- 36b
- Mounting Type :
- Surface Mount
- Qualification Status :
- Not Qualified
- Output Characteristics :
- 3-STATE
- I/O Type :
- Separate
- Memory Interface :
- Parallel
- Clock Frequency :
- 200MHz
- Standby Voltage-Min :
- 1.7V
- Sync/Async :
- SYNCHRONOUS
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Memory Size :
- 72Mb 2M x 36
- Pin Count :
- 165
- Operating Supply Voltage :
- 1.8V
- Memory Format :
- SRAM
- JESD-609 Code :
- e0
- Memory Width :
- 36
- Nominal Supply Current :
- 850mA
- Published :
- 2003
- Supply Voltage :
- 1.8V
- RoHS Status :
- Non-RoHS Compliant
- Length :
- 17mm
- Additional Feature :
- PIPELINED ARCHITECTURE
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Datasheets
- CY7C1515V18-200BZC

Memory Infineon Technologies CY7C1515V18-200BZC Overview
The Memory Infineon Technologies CY7C1515V18-200BZC is a high-performance 72Mbit SRAM device, designed with a parallel interface encapsulated in a compact 165FBGA package. This product from Infineon Technologies exemplifies cutting-edge memory technology that offers rapid access speeds and high reliability, essential for advanced industrial applications. The CY7C1515V18-200BZC is engineered to meet the stringent demands of high-throughput systems, providing a robust storage solution that enhances the overall performance and efficiency of embedded systems. Its capacity and speed make it particularly suitable for applications requiring fast and reliable temporary data storage.
CY7C1515V18-200BZC Features
This integrated circuit boasts several features that make it a standout choice for developers and engineers. It offers a large 72MB of storage capacity, suitable for high-density data accumulation. The device operates at a speed of 200MHz, enabling quick data processing and retrieval, crucial for real-time applications. The 165FBGA package ensures a minimal footprint on the PCB, allowing for more compact system designs. Additionally, its parallel interface facilitates easier integration into existing architectures, enhancing design flexibility and scalability.
CY7C1515V18-200BZC Applications
- Networking Equipment: Utilized in routers and switches for packet buffering, ensuring smooth data flow and minimizing latency.
- High-Performance Computing: Serves as temporary data storage in supercomputers and research facilities, supporting complex simulations and computations.
- Automotive Applications: Used in advanced driver-assistance systems (ADAS) to temporarily store sensor data, crucial for real-time decision-making processes.
- Telecommunications: Helps in managing data in telecommunications infrastructure, aiding in the efficient handling of high-volume, high-speed data transfers.
- Industrial Automation: In automation control systems, it acts as fast-access memory for process control applications, enhancing system responsiveness and reliability.
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