CY7C1512V18-200BZXC

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Mfr.Part #
CY7C1512V18-200BZXC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 72MBIT PARALLEL 165FBGA
Stock
36,223
In Stock :
36,223

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Memory Size :
72Mb 4M x 18
Packaging :
Tray
Supply Voltage-Max (Vsup) :
1.9V
Terminal Finish :
TIN SILVER COPPER
Access Time (Max) :
0.45 ns
Surface Mount :
yes
Number of Terminations :
165
Memory Interface :
Parallel
Pin Count :
165
Height Seated (Max) :
1.4mm
Voltage - Supply :
1.7V~1.9V
Length :
17mm
Mounting Type :
Surface Mount
Package / Case :
165-LBGA
JESD-30 Code :
R-PBGA-B165
Additional Feature :
PIPELINED ARCHITECTURE
JESD-609 Code :
e1
Terminal Position :
BOTTOM
Memory Density :
75497472 bit
Clock Frequency :
200MHz
Organization :
4MX18
Memory Format :
SRAM
Pbfree Code :
yes
Supply Voltage-Min (Vsup) :
1.7V
Number of Functions :
1
Operating Temperature :
0°C~70°C TA
Qualification Status :
COMMERCIAL
Time@Peak Reflow Temperature-Max (s) :
40
Peak Reflow Temperature (Cel) :
260
Supply Voltage :
1.8V
Memory Type :
Volatile
Memory Width :
18
Terminal Pitch :
1mm
Reach Compliance Code :
Unknown
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
15mm
RoHS Status :
ROHS3 Compliant
Introducing Memory Infineon Technologies CY7C1512V18-200BZXC from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:165, Mounting Type:Surface Mount, Package / Case:165-LBGA, Operating Temperature:0°C~70°C TA, CY7C1512V18-200BZXC pinout, CY7C1512V18-200BZXC datasheet PDF, CY7C1512V18-200BZXC amp .Beyond Memory Infineon Technologies CY7C1512V18-200BZXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1512V18-200BZXC


Memory Infineon Technologies CY7C1512V18-200BZXC Overview

The Memory Infineon Technologies CY7C1512V18-200BZXC is a cutting-edge Integrated Circuit (IC) designed by Infineon Technologies, tailored for high-speed and high-capacity storage solutions. This SRAM device features a substantial 72Mbit capacity, encapsulated in a compact 165FBGA package, making it an ideal choice for applications requiring rapid access to large volumes of data. The robust design and advanced manufacturing techniques ensure reliable operation and extended durability, positioning it as a top-tier option for B2B clients looking to integrate reliable memory solutions into their advanced electronic systems.

CY7C1512V18-200BZXC Features

This IC SRAM from Infineon Technologies is engineered for performance, offering features such as high-speed data transfer capabilities with a parallel interface for seamless integration into existing architectures. The 165FBGA packaging not only ensures a small footprint but also enhances thermal management and reduces susceptibility to environmental factors, making it suitable for dense electronic assemblies.

CY7C1512V18-200BZXC Applications

  • High-performance Computing: This SRAM is utilized in servers and workstations where rapid data access is critical, improving processing speed and system efficiency.
  • Networking Equipment: Ideal for use in routers and switches, the CY7C1512V18-200BZXC enhances data buffering and throughput, critical for maintaining high-speed network performance.
  • Telecommunications: Deployed in telecommunications infrastructure, this memory module supports the high-speed data demands of modern telecom systems, ensuring reliable and uninterrupted service.
  • Industrial Automation: In automation systems, quick data retrieval is necessary for real-time control and monitoring, making this IC an essential component in reducing system latency.
  • Aerospace and Defense: Due to its robustness and reliability, the CY7C1512V18-200BZXC is also suited for applications in aerospace and defense, where high resilience and performance are required under extreme conditions.
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IMPORTANT NOTICE

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Shipping Cost

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