CY7C1474BV33-200BGXC
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- Mfr.Part #
- CY7C1474BV33-200BGXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 209-BGA
- Datasheet
- Download
- Description
- IC SRAM 72MBIT PARALLEL 209FBGA
- Stock
- 84
- In Stock ：
- 84
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Address Bus Width :
- 20b
- Word Size :
- 72b
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Operating Supply Voltage :
- 3.3V
- Supply Voltage-Min (Vsup) :
- 3.135V
- Number of Ports :
- 8
- Output Characteristics :
- 3-STATE
- Access Time :
- 3ns
- Additional Feature :
- PIPELINED ARCHITECTURE
- Clock Frequency :
- 200MHz
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Peak Reflow Temperature (Cel) :
- 260
- Memory Interface :
- Parallel
- Sync/Async :
- SYNCHRONOUS
- Density :
- 72 Mb
- Supply Voltage :
- 3.3V
- Memory Format :
- SRAM
- Memory Type :
- Volatile
- Published :
- 2004
- Memory Size :
- 72Mb 1M x 72
- JESD-609 Code :
- e1
- Factory Lead Time :
- 7 Weeks
- Packaging :
- Tray
- Operating Temperature :
- 0°C~70°C TA
- Radiation Hardening :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RoHS Status :
- ROHS3 Compliant
- Package / Case :
- 209-BGA
- Organization :
- 1MX72
- Number of Pins :
- 209
- ECCN Code :
- 3A991.B.2.A
- Base Part Number :
- CY7C1474
- Mounting Type :
- Surface Mount
- Number of Terminations :
- 209
- Supply Voltage-Max (Vsup) :
- 3.6V
- Number of Functions :
- 1
- Series :
- NoBL™
- Memory Width :
- 72
- I/O Type :
- COMMON
- Lead Free :
- Lead Free
- Standby Voltage-Min :
- 3.14V
- Length :
- 22mm
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1mm
- Pin Count :
- 209
- Nominal Supply Current :
- 500mA
- Height Seated (Max) :
- 1.96mm
- Voltage - Supply :
- 3.135V~3.6V
- Mount :
- Surface Mount
- Datasheets
- CY7C1474BV33-200BGXC
Memory Infineon Technologies CY7C1474BV33-200BGXC Overview
The Memory Infineon Technologies CY7C1474BV33-200BGXC is a high-performance, 72Mbit SRAM chip designed for advanced applications requiring fast and reliable data storage. Manufactured by Infineon Technologies, this integrated circuit features a parallel interface and is housed in a 209FBGA package, optimizing both thermal and mechanical performance. Its robust design and high-speed capabilities make it an ideal solution for meeting the rigorous demands of high-speed data environments. The focus on delivering rapid access and data integrity ensures that this memory chip stands out as a leader in its class, attracting B2B customers looking for volume purchases of reliable and efficient memory solutions.
CY7C1474BV33-200BGXC Features
This SRAM device boasts several features that enhance its performance, including a fast access time and a wide bus interface, which facilitate quick data retrieval and high throughput. Its low power consumption and advanced power management capabilities ensure efficiency and longevity in applications, making it a particularly suitable choice for both portable and high-performance fixed systems. Additionally, the CY7C1474BV33-200BGXC supports a variety of operating modes, providing flexibility in its use across different technology platforms.
CY7C1474BV33-200BGXC Applications
- Networking Equipment: Used in routers and switches, the CY7C1474BV33-200BGXC aids in managing data flow efficiently, ensuring high-speed data processing and reliability essential for network infrastructure.
- Telecommunications: This SRAM chip is integral in telecommunications infrastructure, where large volumes of data must be accessed quickly and reliably, such as in base stations and network interfaces.
- Industrial Automation: In automation systems, the high-speed and reliable data access offered by CY7C1474BV33-200BGXC is crucial for real-time control systems and complex machine operations.
- Medical Equipment: Used in medical imaging systems, the chip facilitates the quick processing and storage of large image files, which is critical for effective diagnosis and patient care.
- Aerospace and Defense: The robustness of the CY7C1474BV33-200BGXC makes it suitable for applications in aerospace and defense, where equipment must operate reliably under extreme conditions.
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