CY7C1474BV25-167BGCT
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- Mfr.Part #
- CY7C1474BV25-167BGCT
- Manufacturer
- Infineon Technologies
- Package / Case
- 209-BGA
- Datasheet
- Download
- Description
- IC SRAM 72MBIT PARALLEL 209FBGA
- Stock
- 38,055
- In Stock ：
- 38,055
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Base Part Number :
- CY7C1474
- Min Operating Temperature :
- 0°C
- Supplier Device Package :
- 209-FBGA (14x22)
- Max Supply Voltage :
- 2.625V
- Memory Type :
- Volatile
- Published :
- 2004
- Mounting Type :
- Surface Mount
- Memory Interface :
- Parallel
- Max Frequency :
- 167MHz
- Clock Frequency :
- 167MHz
- Memory Size :
- 72Mb 1M x 72
- Access Time :
- 3.4ns
- Memory Format :
- SRAM
- Interface :
- Parallel
- Package / Case :
- 209-BGA
- RoHS Status :
- Non-RoHS Compliant
- Min Supply Voltage :
- 2.375V
- Voltage - Supply :
- 2.375V~2.625V
- Max Operating Temperature :
- 70°C
- Packaging :
- Tape and Reel (TR)
- Frequency :
- 167MHz
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Series :
- NoBL™
- Operating Temperature :
- 0°C~70°C TA
- Datasheets
- CY7C1474BV25-167BGCT
Memory Infineon Technologies CY7C1474BV25-167BGCT Overview
The Memory Infineon Technologies CY7C1474BV25-167BGCT is a high-performance 72Mbit SRAM chip designed for applications requiring fast access and high bandwidth in a reliable package. Manufactured by Infineon Technologies, this integrated circuit boasts a parallel interface and comes housed in a 209FBGA package, ensuring robustness and ease of integration into various hardware environments. Its high-speed performance and large memory capacity make it an ideal choice for demanding applications that require rapid data retrieval and storage. The advanced technology integrated into this memory module facilitates improved system reliability and performance, which is crucial for industrial and high-tech applications.
CY7C1474BV25-167BGCT Features
This SRAM chip provides a memory capacity of 72MBIT and operates on a parallel interface, offering high-speed data handling capabilities. It is designed to meet the stringent requirements of both power efficiency and data integrity while providing flexibility in application across various fields. The 209FBGA packaging not only protects the integrity of the silicon but also supports efficient thermal management and space-saving mounting on printed circuit boards.
CY7C1474BV25-167BGCT Applications
- Telecommunications Equipment: Utilized in routers and switches for caching and buffering data, enhancing overall data flow and system responsiveness.
- Networking Hardware: Acts as a high-speed, temporary data store in network interface cards, facilitating smooth and efficient data transfer and processing.
- High-performance Computing: Supports complex computations and processes in supercomputers and workstations by providing quick access to large amounts of data.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) for real-time processing and data storage, contributing to vehicle safety and performance enhancements.
- Industrial Automation: Integral in programmable logic controllers (PLCs) and industrial PCs, ensuring high reliability and speed in controlling machinery and processing industrial data.
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