CY7C1471BV25-133BZXC

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Mfr.Part #
CY7C1471BV25-133BZXC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 72MBIT PARALLEL 165FBGA
Stock
106
In Stock :
106

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Clock Frequency :
133MHz
Packaging :
Tray
Series :
NoBL™
Supplier Device Package :
165-FBGA (15x17)
Voltage - Supply :
2.375V~2.625V
Memory Type :
Volatile
Package / Case :
165-LBGA
Memory Interface :
Parallel
Operating Temperature :
0°C~70°C TA
Access Time :
6.5ns
RoHS Status :
ROHS3 Compliant
Memory Size :
72Mb 2M x 36
Mounting Type :
Surface Mount
Memory Format :
SRAM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Introducing Memory Infineon Technologies CY7C1471BV25-133BZXC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, CY7C1471BV25-133BZXC pinout, CY7C1471BV25-133BZXC datasheet PDF, CY7C1471BV25-133BZXC amp .Beyond Memory Infineon Technologies CY7C1471BV25-133BZXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1471BV25-133BZXC


Memory Infineon Technologies CY7C1471BV25-133BZXC Overview

The Memory Infineon Technologies CY7C1471BV25-133BZXC is a high-performance, 72Mbit SRAM module designed for demanding applications requiring rapid access to large volumes of data. Manufactured by Infineon Technologies, this IC utilizes a parallel interface for high-speed data transfer and is packaged in a compact 165FBGA format, ensuring minimal space usage with maximum reliability. Ideal for businesses seeking robust memory solutions, this product offers exceptional durability and performance consistency, making it a preferred choice for bulk purchasing among B2B clients.

CY7C1471BV25-133BZXC Features

The CY7C1471BV25-133BZXC SRAM boasts a wide array of features including a 72Mbit storage capacity and a parallel interface that ensures high-speed data access and processing capabilities. The 165FBGA package is designed for efficient space utilization and enhanced thermal stability, which is crucial for maintaining performance in extensive and demanding operations. Additionally, its robust design is tailored to withstand the rigors of intense industrial applications, providing a reliable and consistent performance that enterprise clients can depend on.

CY7C1471BV25-133BZXC Applications

  • Networking Equipment: Utilized in routers and switches for buffering and high-speed packet storage, facilitating smooth and efficient network traffic management.
  • Telecommunications: Deployed in telecommunications infrastructure to manage data flow and signal processing swiftly, ensuring reliable communication services.
  • High-Performance Computing: Integral in data centers and supercomputers where rapid access to large amounts of data is critical for processing and analysis tasks.
  • Automotive Electronics: Used in advanced driver-assistance systems (ADAS) for real-time data processing, helping to improve vehicle safety and functionality.
  • Industrial Automation: Supports complex automated systems in industrial settings by providing quick data retrieval and storage, enhancing operational efficiency and machine-to-machine communication.
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Shipping Method

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Shipping Cost

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