CY7C1470BV25-200BZC
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- Mfr.Part #
- CY7C1470BV25-200BZC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 72MBIT PARALLEL 165FBGA
- Stock
- 49,110
- In Stock ：
- 49,110
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Operating Temperature :
- 0°C~70°C TA
- Supplier Device Package :
- 165-FBGA (15x17)
- Frequency :
- 200MHz
- Package / Case :
- 165-LBGA
- Access Time :
- 3ns
- Number of Pins :
- 165
- Mounting Type :
- Surface Mount
- Base Part Number :
- CY7C1470
- Memory Format :
- SRAM
- Min Supply Voltage :
- 2.375V
- Memory Interface :
- Parallel
- Packaging :
- Tape and Reel (TR)
- Memory Type :
- Volatile
- Clock Frequency :
- 200MHz
- Min Operating Temperature :
- 0°C
- Memory Size :
- 72Mb 2M x 36
- Max Supply Voltage :
- 2.625V
- Series :
- NoBL™
- Published :
- 2004
- Max Operating Temperature :
- 70°C
- Max Frequency :
- 200MHz
- Voltage - Supply :
- 2.375V~2.625V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Interface :
- Parallel
- RoHS Status :
- Non-RoHS Compliant
- Datasheets
- CY7C1470BV25-200BZC
Memory Infineon Technologies CY7C1470BV25-200BZC Overview
Introducing the Memory Infineon Technologies CY7C1470BV25-200BZC, a high-performance 72Mbit SRAM component from Infineon Technologies. Designed for demanding applications that require rapid access to large volumes of data, this integrated circuit boasts a parallel interface and is packaged in a compact 165FBGA form factor. Its robust design and cutting-edge technology make it ideal for applications where speed and reliability are paramount. This SRAM's ability to support high-speed data transmission and storage under rigorous conditions ensures it is a go-to solution for developers and engineers looking to enhance system performance and reliability.
CY7C1470BV25-200BZC Features
The CY7C1470BV25-200BZC offers a range of features designed for advanced electronic systems. With a 72Mbit capacity and a parallel interface, it provides high-speed access and fast data throughput. The chip's 165FBGA package is optimized for efficient space utilization and enhanced thermal stability, making it suitable for compact designs without compromising performance.
CY7C1470BV25-200BZC Applications
- Networking Equipment: Utilized in routers and switches for buffering and high-speed data caching, ensuring smooth data flow and reduced latency.
- Telecommunications: Key component in telecom infrastructure, supporting fast access to data buffers needed in communication hardware.
- High-Performance Computing: Integral in servers and supercomputers for temporary data storage during intensive processing tasks, enhancing overall computational speed and efficiency.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) for real-time processing and data storage, contributing to vehicle safety and performance.
- Industrial Automation: Employs in control systems for real-time data logging and process management, facilitating increased automation and precision.
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