CY7C1464AV25-167BGC
- Mfr.Part #
- CY7C1464AV25-167BGC
- Manufacturer
- Infineon Technologies
- Package / Case
- 209-BGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 209FBGA
- Stock
- 5,168
- In Stock :
- 5,168
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Reach Compliance Code :
- not_compliant
- Memory Type :
- Volatile
- Clock Frequency :
- 167MHz
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Organization :
- 512KX72
- Peak Reflow Temperature (Cel) :
- 220
- Operating Temperature :
- 0°C~70°C TA
- Sync/Async :
- SYNCHRONOUS
- Additional Feature :
- PIPELINED ARCHITECTURE
- Number of Functions :
- 1
- Number of Terminations :
- 209
- Access Time :
- 3.4ns
- Pin Count :
- 209
- Packaging :
- Tray
- Memory Size :
- 36Mb 512K x 72
- Address Bus Width :
- 19b
- Supply Voltage-Max (Vsup) :
- 2.625V
- Standby Current-Max :
- 0.12A
- Memory Interface :
- Parallel
- Supply Voltage :
- 2.5V
- Voltage - Supply :
- 2.375V~2.625V
- Terminal Position :
- BOTTOM
- Mount :
- Surface Mount
- Number of Ports :
- 8
- Length :
- 22mm
- Word Size :
- 72b
- Mounting Type :
- Surface Mount
- JESD-609 Code :
- e0
- Memory Format :
- SRAM
- ECCN Code :
- 3A991.B.2.A
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Density :
- 36 Mb
- Supply Voltage-Min (Vsup) :
- 2.375V
- Terminal Pitch :
- 1mm
- RoHS Status :
- Non-RoHS Compliant
- Package / Case :
- 209-BGA
- Operating Supply Voltage :
- 2.5V
- Lead Free :
- Contains Lead
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Height Seated (Max) :
- 1.96mm
- I/O Type :
- COMMON
- Published :
- 2006
- Base Part Number :
- CY7C1464
- Nominal Supply Current :
- 335mA
- Qualification Status :
- Not Qualified
- Memory Width :
- 72
- Number of Pins :
- 209
- Output Characteristics :
- 3-STATE
- Datasheets
- CY7C1464AV25-167BGC

Memory Infineon Technologies CY7C1464AV25-167BGC Overview
The Memory Infineon Technologies CY7C1464AV25-167BGC is a high-performance 36Mbit SRAM module designed by Infineon Technologies, catering specifically to applications requiring fast access and high bandwidth in a compact form factor. This integrated circuit features a parallel interface and is encapsulated in a 209-pin FBGA (Fine Pitch Ball Grid Array) package. The robust design ensures reliable operation in a wide range of temperatures, making it an ideal choice for demanding industrial applications where durability and performance are critical. The Memory Infineon Technologies CY7C1464AV25-167BGC combines advanced memory technology with Infineon's proven reliability, positioning it as a key component for developers and manufacturers aiming to enhance system performance and stability.
CY7C1464AV25-167BGC Features
The CY7C1464AV25-167BGC by Infineon Technologies boasts several key features that make it stand out in the realm of high-density SRAMs. These include a large 36Mbit capacity, a parallel interface for rapid data transfer, and a compact 209FBGA packaging that minimizes space requirements on printed circuit boards. Additionally, its ability to operate over a wide range of industrial temperatures enhances its usability in diverse environmental conditions, ensuring consistent performance.
CY7C1464AV25-167BGC Applications
- Networking Equipment: Used in routers and switches for packet buffering, ensuring efficient data flow and speed optimization in network communication.
- High-Performance Computing: Integral in workstations and servers where high-speed data access is crucial for processing large datasets and performing complex calculations rapidly.
- Automotive Applications: Utilized in advanced driver-assistance systems (ADAS) to handle real-time data processing, contributing to enhanced vehicular safety and functionality.
- Industrial Automation: Employs in control systems to manage process data, aiding in the seamless operation of machinery and ensuring reliability and precision in harsh industrial environments.
- Telecommunication Infrastructure: Facilitates data retention in telecommunication equipment, supporting system reliability and performance in managing and switching high-volume communications.
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