CY7C1426AV18-200BZXC
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- Mfr.Part #
- CY7C1426AV18-200BZXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 165FBGA
- Stock
- 24,120
- In Stock ：
- 24,120
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Standby Voltage-Min :
- 1.7V
- Mounting Type :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Memory Format :
- SRAM
- Peak Reflow Temperature (Cel) :
- 260
- Memory Interface :
- Parallel
- Length :
- 17mm
- Packaging :
- Tray
- JESD-609 Code :
- e1
- Lead Free :
- Lead Free
- Surface Mount :
- yes
- Standby Current-Max :
- 0.3A
- Height Seated (Max) :
- 1.4mm
- Pin Count :
- 165
- ECCN Code :
- 3A991.B.2.A
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Supply Voltage-Max (Vsup) :
- 1.9V
- Memory Type :
- Volatile
- Package / Case :
- 165-LBGA
- Access Time :
- 450 ps
- Base Part Number :
- CY7C1426
- HTS Code :
- 8542.32.00.41
- Number of Terminations :
- 165
- Supply Voltage :
- 1.8V
- Number of Pins :
- 165
- Clock Frequency :
- 200MHz
- Additional Feature :
- PIPELINED ARCHITECTURE
- Memory Density :
- 37748736 bit
- Qualification Status :
- Not Qualified
- Power Supplies :
- 1.5/1.81.8V
- Organization :
- 4MX9
- Voltage - Supply :
- 1.7V~1.9V
- I/O Type :
- Separate
- Memory Width :
- 9
- Output Characteristics :
- 3-STATE
- Supply Voltage-Min (Vsup) :
- 1.7V
- Terminal Pitch :
- 1mm
- Number of Functions :
- 1
- Published :
- 2003
- Terminal Position :
- BOTTOM
- Width :
- 15mm
- Supply Current-Max :
- 0.7mA
- Reach Compliance Code :
- Unknown
- Memory Size :
- 36Mb 4M x 9
- RoHS Status :
- ROHS3 Compliant
- Operating Temperature :
- 0°C~70°C TA
- Datasheets
- CY7C1426AV18-200BZXC
Memory Infineon Technologies CY7C1426AV18-200BZXC Overview
The Memory Infineon Technologies CY7C1426AV18-200BZXC is a high-performance 36Mbit SRAM device engineered by Infineon Technologies. This IC offers a robust parallel interface, housed in a compact 165FBGA package, ensuring high-speed data retrieval and storage. Ideal for applications demanding high memory bandwidth and reliability, this memory component significantly enhances system performance through its advanced design and Infineon's proven technology. The Memory Infineon Technologies CY7C1426AV18-200BZXC stands out in the market for its ability to support intensive processing tasks and operate in demanding conditions, making it a preferred choice for enterprise-level solutions.
CY7C1426AV18-200BZXC Features
This SRAM chip features a large 36Mbit capacity with a fast access time, provided by the 200MHz clock speed, which is crucial for high-performance computing environments. Its parallel interface ensures efficient communication and data handling. The 165FBGA package is designed for optimal space utilization and thermal stability, enhancing the reliability and longevity of the device in various operational contexts.
CY7C1426AV18-200BZXC Applications
- Networking Equipment: Utilized in routers and switches, the CY7C1426AV18-200BZXC enhances data flow management and speeds up packet processing capabilities.
- Telecommunications: Plays a critical role in telecom infrastructure by facilitating faster and more reliable data storage and access, essential for real-time communication services.
- High-performance Computing: Supports the demands of supercomputing systems by providing the necessary speed and capacity for large-scale data processing and simulations.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to manage real-time sensor data, contributing to safer and smarter vehicle operations.
- Industrial Automation: Enhances control systems by providing high-speed memory solutions that improve the responsiveness and efficiency of automated processes.
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