CY7C1425JV18-267BZIT
- Mfr.Part #
- CY7C1425JV18-267BZIT
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 165FBGA
- Stock
- 17,031
- In Stock :
- 17,031
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Frequency :
- 267MHz
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Voltage - Supply :
- 1.7V~1.9V
- Memory Type :
- Volatile
- RoHS Status :
- Non-RoHS Compliant
- Operating Supply Voltage :
- 1.8V
- Access Time :
- 450 ps
- Packaging :
- Tape and Reel (TR)
- Supplier Device Package :
- 165-FBGA (15x17)
- Base Part Number :
- CY7C1425
- Lead Free :
- Contains Lead
- Max Supply Voltage :
- 1.9V
- Max Operating Temperature :
- 85°C
- Mounting Type :
- Surface Mount
- Clock Frequency :
- 267MHz
- Memory Size :
- 36Mb 4M x 9
- Max Frequency :
- 267MHz
- Min Supply Voltage :
- 1.7V
- Memory Interface :
- Parallel
- Package / Case :
- 165-LBGA
- Number of Pins :
- 165
- Operating Temperature :
- -40°C~85°C TA
- Density :
- 36 Mb
- Interface :
- Parallel
- Published :
- 2011
- Min Operating Temperature :
- -40°C
- Memory Format :
- SRAM
- Datasheets
- CY7C1425JV18-267BZIT

Memory Infineon Technologies CY7C1425JV18-267BZIT Overview
The Memory Infineon Technologies CY7C1425JV18-267BZIT is a high-performance 36Mbit SRAM device, designed to meet the rigorous demands of advanced parallel processing environments. Manufactured by Infineon Technologies, this IC leverages a 165FBGA package, combining compact form factor with robustness. Its ability to handle high-speed data transactions and reliable operation under varied conditions makes it an ideal choice for applications requiring rapid access to large volumes of data. The integration of this memory component into your systems promises to enhance performance, providing a competitive edge in technological advancements.
CY7C1425JV18-267BZIT Features
This IC SRAM from Infineon Technologies features a 36Mbit capacity with parallel interface, offering high-speed access and seamless integration into existing architectures. The 165FBGA packaging not only ensures a reduced footprint but also enhances thermal management and reduces latency. Optimized for high reliability and endurance, the CY7C1425JV18-267BZIT is suitable for intensive applications where speed and stability are critical.
CY7C1425JV18-267BZIT Applications
- Networking Equipment: Enhances data buffer management and speed in switches and routers, ensuring efficient packet transfer and low latency in high-traffic networks.
- High-Performance Computing (HPC): Facilitates faster data access for computational analysis and simulation, critical in scientific research and financial modeling.
- Telecommunications: Supports the demands of telecommunications infrastructure by providing high-speed, reliable memory for signal processing and data management.
- Video Streaming: Improves buffering and latency, crucial for video encoding and decoding processes in high-definition video streaming services.
- Gaming Consoles: Enhances gaming experience by speeding up load times and real-time data processing, ensuring smoother gameplay and graphics rendering.
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