CY7C1423BV18-250BZC

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Mfr.Part #
CY7C1423BV18-250BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165FBGA
Stock
17,766
In Stock :
17,766

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Operating Supply Voltage :
1.8V
Density :
36 Mb
Height Seated (Max) :
1.4mm
Number of Terminations :
165
Nominal Supply Current :
740mA
Clock Frequency :
250MHz
Memory Format :
SRAM
I/O Type :
Separate
Standby Voltage-Min :
1.7V
Additional Feature :
PIPELINED ARCHITECTURE
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Base Part Number :
CY7C1423
Operating Temperature :
0°C~70°C TA
Published :
2003
Pin Count :
165
Terminal Finish :
Tin/Lead (Sn/Pb)
Length :
17mm
Output Characteristics :
3-STATE
Terminal Pitch :
1mm
Peak Reflow Temperature (Cel) :
220
Mount :
Surface Mount
Address Bus Width :
20b
Number of Functions :
1
Supply Voltage-Min (Vsup) :
1.7V
Access Time :
450 ps
Memory Interface :
Parallel
Number of Pins :
165
Packaging :
Tray
Sync/Async :
SYNCHRONOUS
Memory Type :
Volatile
Number of Ports :
2
Supply Voltage :
1.8V
Supply Voltage-Max (Vsup) :
1.9V
Memory Size :
36Mb 2M x 18
Reach Compliance Code :
not_compliant
Qualification Status :
Not Qualified
Terminal Position :
BOTTOM
Word Size :
18b
Voltage - Supply :
1.7V~1.9V
RoHS Status :
Non-RoHS Compliant
Memory Width :
18
JESD-609 Code :
e0
Package / Case :
165-LBGA
Introducing Memory Infineon Technologies CY7C1423BV18-250BZC from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:165, Mounting Type:Surface Mount, Base Part Number:CY7C1423, Operating Temperature:0°C~70°C TA, Number of Pins:165, Package / Case:165-LBGA, CY7C1423BV18-250BZC pinout, CY7C1423BV18-250BZC datasheet PDF, CY7C1423BV18-250BZC amp .Beyond Memory Infineon Technologies CY7C1423BV18-250BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1423BV18-250BZC


Memory Infineon Technologies CY7C1423BV18-250BZC Overview

The Memory Infineon Technologies CY7C1423BV18-250BZC is a high-performance, 36Mbit SRAM chip, encapsulated in a 165FBGA package, designed to meet the rigorous demands of high-speed data buffering in telecom and networking infrastructures. This SRAM module from Infineon Technologies ensures reliable and rapid access to data, critical for systems requiring high bandwidth and low latency. Its robust design and advanced technology serve as a cornerstone for developers looking to push the boundaries of memory storage solutions.

CY7C1423BV18-250BZC Features

This SRAM device boasts a parallel interface, offering high-speed data transfer rates and compatibility with a wide range of industrial applications. The 36Mbit capacity provides ample space for critical data that needs to be accessed quickly and efficiently. Its compact 165FBGA package ensures minimized space usage, ideal for systems where board space is at a premium. Additionally, the CY7C1423BV18-250BZC operates at a speed grade of 250MHz, making it exceptionally well-suited for applications requiring fast and reliable memory access.

CY7C1423BV18-250BZC Applications

  • Telecommunications Equipment: Utilized for data buffering in routers and switches, enhancing the performance and efficiency of data transmission across networks.
  • Networking Hardware: Serves as high-speed, temporary storage in network bridges, ensuring seamless data flow and reduced bottlenecks in network traffic.
  • High-Performance Computing: Used in servers and computing arrays for fast access to frequently used data, significantly reducing latency and improving system responsiveness.
  • Video Streaming Technology: Employs in buffering applications for high-definition video streaming, supporting smooth and uninterrupted viewing experiences.
  • Aerospace and Defense: Critical in applications requiring robust, high-speed data access under extreme environmental conditions, contributing to reliability and performance in mission-critical systems.
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