CY7C1415BV18-250BZC

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Mfr.Part #
CY7C1415BV18-250BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165FBGA
Stock
6,604
In Stock :
6,604

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Mount :
Surface Mount
Reach Compliance Code :
not_compliant
Output Characteristics :
3-STATE
RoHS Status :
Non-RoHS Compliant
Number of Functions :
1
Voltage - Supply :
1.7V~1.9V
Additional Feature :
PIPELINED ARCHITECTURE
Memory Format :
SRAM
Peak Reflow Temperature (Cel) :
220
Density :
36 Mb
Operating Supply Voltage :
1.8V
Terminal Finish :
Tin/Lead (Sn/Pb)
Standby Current-Max :
0.37A
Supply Voltage-Max (Vsup) :
1.9V
Pin Count :
165
Number of Terminations :
165
Address Bus Width :
18b
Package / Case :
165-LBGA
Memory Type :
Volatile
Qualification Status :
Not Qualified
Base Part Number :
CY7C1415
Memory Size :
36Mb 1M x 36
Operating Temperature :
0°C~70°C TA
I/O Type :
Separate
Number of Ports :
2
JESD-609 Code :
e0
Height Seated (Max) :
1.4mm
Supply Voltage :
1.8V
Packaging :
Tray
Memory Width :
36
Published :
2003
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Word Size :
36b
Terminal Position :
BOTTOM
Number of Pins :
165
Access Time :
450 ps
Standby Voltage-Min :
1.7V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Supply Voltage-Min (Vsup) :
1.7V
Length :
17mm
Nominal Supply Current :
870mA
Terminal Pitch :
1mm
Sync/Async :
SYNCHRONOUS
Memory Interface :
Parallel
Organization :
1MX36
Mounting Type :
Surface Mount
Clock Frequency :
250MHz
Introducing Memory Infineon Technologies CY7C1415BV18-250BZC from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:165, Package / Case:165-LBGA, Base Part Number:CY7C1415, Operating Temperature:0°C~70°C TA, Number of Pins:165, Mounting Type:Surface Mount, CY7C1415BV18-250BZC pinout, CY7C1415BV18-250BZC datasheet PDF, CY7C1415BV18-250BZC amp .Beyond Memory Infineon Technologies CY7C1415BV18-250BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1415BV18-250BZC


Memory Infineon Technologies CY7C1415BV18-250BZC Overview

Introducing the Memory Infineon Technologies CY7C1415BV18-250BZC, a state-of-the-art IC SRAM component designed for high-speed, high-capacity storage solutions. With a substantial 36Mbit capacity, this product is encapsulated in a compact 165FBGA package, offering robust parallel processing capabilities. Developed by Infineon Technologies, a leader in semiconductor innovation, this SRAM module is optimized for applications requiring fast access and reliable data retention. Its performance and size make it an ideal choice for sophisticated electronic systems, enhancing both system efficiency and reliability.

CY7C1415BV18-250BZC Features

The CY7C1415BV18-250BZC boasts several key features that set it apart in the electronics market. It offers a high storage capacity of 36Mbit, which is essential for data-intensive applications. The parallel interface ensures rapid data access and processing, suitable for high-performance computing environments. Moreover, its 165FBGA packaging is designed for optimal space utilization and enhanced thermal management, making it suitable for compact devices that require high-density memory storage.

CY7C1415BV18-250BZC Applications

  • Networking Equipment: Utilized in routers and switches to enhance buffer management and data throughput, facilitating improved network performance and reliability.
  • High-performance Computing: Acts as temporary storage for large datasets during intensive computational processes, ensuring swift access to data and smoother operation.
  • Automotive Applications: Employs in advanced driver-assistance systems (ADAS) for real-time data processing, contributing to vehicle safety and performance.
  • Industrial Automation: Integrates into control systems for managing operations efficiently, aiding in faster processing and response times in critical industrial applications.
  • Telecommunications: Supports telecommunications infrastructure by providing high-speed data caching capabilities, which are crucial for managing vast amounts of data transfers.
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