CY7C1415BV18-167BZI

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Mfr.Part #
CY7C1415BV18-167BZI
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165FBGA
Stock
194
In Stock :
194

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Manufacturer :
Infineon Technologies
Product Category :
Memory
RoHS Status :
Non-RoHS Compliant
Access Time (Max) :
0.5 ns
Supply Voltage-Min (Vsup) :
1.7V
Terminal Pitch :
1mm
Operating Temperature :
-40°C~85°C TA
Additional Feature :
PIPELINED ARCHITECTURE
JESD-30 Code :
R-PBGA-B165
Pin Count :
165
Qualification Status :
COMMERCIAL
Packaging :
Tray
Memory Width :
36
Number of Terminations :
165
JESD-609 Code :
e0
Memory Density :
37748736 bit
Clock Frequency :
167MHz
Width :
15mm
Supply Voltage :
1.8V
Supply Voltage-Max (Vsup) :
1.9V
Memory Size :
36Mb 1M x 36
Reach Compliance Code :
Unknown
Length :
17mm
Mounting Type :
Surface Mount
Terminal Position :
BOTTOM
Voltage - Supply :
1.7V~1.9V
Package / Case :
165-LBGA
Height Seated (Max) :
1.4mm
Terminal Finish :
TIN LEAD
Surface Mount :
yes
Memory Type :
Volatile
Number of Functions :
1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
SRAM
Memory Interface :
Parallel
Organization :
1MX36
Introducing Memory Infineon Technologies CY7C1415BV18-167BZI from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Number of Terminations:165, Mounting Type:Surface Mount, Package / Case:165-LBGA, CY7C1415BV18-167BZI pinout, CY7C1415BV18-167BZI datasheet PDF, CY7C1415BV18-167BZI amp .Beyond Memory Infineon Technologies CY7C1415BV18-167BZI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1415BV18-167BZI


Memory Infineon Technologies CY7C1415BV18-167BZI Overview

The Memory Infineon Technologies CY7C1415BV18-167BZI is a high-performance, 36Mbit SRAM module crafted by Infineon Technologies, offering a robust solution for demanding digital storage requirements. This device is encased in a compact 165-ball Fine-Pitch Ball Grid Array (FBGA) package, ensuring minimal footprint on system boards. Designed to deliver high-speed, reliable access to large volumes of data, it is ideal for applications requiring rapid data retrieval and high bandwidth. Its parallel interface facilitates quick data handling, making it a prime choice for sophisticated, high-speed computing environments.

CY7C1415BV18-167BZI Features

This SRAM chip boasts several key features that make it an indispensable component in advanced electronics systems. It offers a parallel interface for high-speed data access, operates with a core supply voltage typical of modern high-speed logic, and its 36Mbit capacity enables substantial data storage in a tiny physical form factor. The device's robust design ensures reliability and performance consistency, critical for industrial and commercial applications.

CY7C1415BV18-167BZI Applications

  • Networking Equipment: Utilized in routers and switches for packet buffering and data queuing, ensuring efficient data flow and management in complex network infrastructures.
  • High-Performance Computing: Deployed in servers and workstations to accelerate data processing and enhance computational speed and reliability in data centers and research facilities.
  • Telecommunications: Integral for use in telecommunications infrastructure, supporting high-speed data transmission and real-time signal processing.
  • Aerospace and Defense: Applies in systems requiring high-speed, reliable data storage for mission-critical applications in challenging environments.
  • Medical Imaging: Essential in advanced medical imaging devices such as CT and MRI machines, where rapid data access is crucial for real-time processing and image reconstruction.
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Shipping Cost

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