CY7C1414JV18-267BZC

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Mfr.Part #
CY7C1414JV18-267BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165FBGA
Stock
112
In Stock :
112

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Package / Case :
165-LBGA
Length :
17mm
Voltage - Supply :
1.7V~1.9V
JESD-30 Code :
R-PBGA-B165
Terminal Position :
BOTTOM
Memory Type :
Volatile
RoHS Status :
Non-RoHS Compliant
Pin Count :
165
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Finish :
NOT SPECIFIED
Number of Terminations :
165
Supply Voltage-Max (Vsup) :
1.9V
Supply Voltage-Min (Vsup) :
1.7V
Organization :
1MX36
Supply Voltage :
1.8V
Memory Size :
36Mb 1M x 36
Number of Functions :
1
Additional Feature :
PIPELINED ARCHITECTURE
Terminal Pitch :
1mm
Packaging :
Tray
Memory Density :
37748736 bit
Access Time (Max) :
0.45 ns
Width :
15mm
Height Seated (Max) :
1.4mm
Memory Format :
SRAM
Operating Temperature :
0°C~70°C TA
Mounting Type :
Surface Mount
Reach Compliance Code :
Unknown
Qualification Status :
COMMERCIAL
Memory Interface :
Parallel
Clock Frequency :
267MHz
Memory Width :
36
Surface Mount :
yes
Introducing Memory Infineon Technologies CY7C1414JV18-267BZC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Number of Terminations:165, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, CY7C1414JV18-267BZC pinout, CY7C1414JV18-267BZC datasheet PDF, CY7C1414JV18-267BZC amp .Beyond Memory Infineon Technologies CY7C1414JV18-267BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1414JV18-267BZC


Memory Infineon Technologies CY7C1414JV18-267BZC Overview

The Memory Infineon Technologies CY7C1414JV18-267BZC is a high-capacity, 36Mbit SRAM chip designed for demanding applications requiring fast access and high bandwidth. Manufactured by Infineon Technologies, this integrated circuit leverages advanced 165FBGA packaging technology to ensure reliability and performance. This SRAM module is optimized for parallel interface, enhancing system performance through quicker data retrieval and storage. Its robust design and large memory capacity make it an ideal choice for businesses seeking efficient, high-speed memory solutions to enhance their system architectures.

CY7C1414JV18-267BZC Features

This SRAM device features a large 36Mbit storage capacity with a parallel interface that ensures fast data access speeds. The chip is encased in a compact 165FBGA package, which provides enhanced thermal stability and durability under a wide range of environmental conditions. Additionally, it operates efficiently across a broad spectrum of temperatures, making it suitable for rigorous industrial applications.

CY7C1414JV18-267BZC Applications

  • Networking Equipment: Utilized in routers and switches for buffer memory, facilitating fast packet storage and retrieval, enhancing overall network performance.
  • Telecommunications: Deployed in telecom infrastructure, supporting high-speed data transactions and reliability required for telecom operations.
  • High-Performance Computing: Ideal for use in servers and supercomputers where large volumes of data are processed and quick access to temporary data storage is crucial.
  • Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to process large amounts of data from sensors and cameras in real time.
  • Industrial Automation: Helps in managing complex operations in industrial control systems, aiding in faster processing and improved control accuracy.
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Shipping Cost

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