CY7C1413JV18-300BZXC
- Mfr.Part #
- CY7C1413JV18-300BZXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 165FBGA
- Stock
- 11,656
- In Stock :
- 11,656
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Memory Width :
- 18
- Additional Feature :
- PIPELINED ARCHITECTURE
- Supply Voltage-Min (Vsup) :
- 1.7V
- Packaging :
- Tray
- Number of Functions :
- 1
- Memory Density :
- 37748736 bit
- Organization :
- 2MX18
- Memory Interface :
- Parallel
- Mounting Type :
- Surface Mount
- JESD-30 Code :
- R-PBGA-B165
- Pin Count :
- 165
- Height Seated (Max) :
- 1.4mm
- Supply Voltage :
- 1.8V
- Qualification Status :
- COMMERCIAL
- Reach Compliance Code :
- Unknown
- Length :
- 17mm
- RoHS Status :
- ROHS3 Compliant
- Memory Type :
- Volatile
- Terminal Pitch :
- 1mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Format :
- SRAM
- Surface Mount :
- yes
- Access Time (Max) :
- 0.45 ns
- Package / Case :
- 165-LBGA
- Supply Voltage-Max (Vsup) :
- 1.9V
- Voltage - Supply :
- 1.7V~1.9V
- Width :
- 15mm
- Memory Size :
- 36Mb 2M x 18
- Clock Frequency :
- 300MHz
- Terminal Position :
- BOTTOM
- Operating Temperature :
- 0°C~70°C TA
- Terminal Finish :
- NOT SPECIFIED
- Number of Terminations :
- 165
- Datasheets
- CY7C1413JV18-300BZXC

Memory Infineon Technologies CY7C1413JV18-300BZXC Overview
The Memory Infineon Technologies CY7C1413JV18-300BZXC is a high-performance 36Mbit SRAM IC that offers robust parallel interfaces housed in a compact 165FBGA package. Engineered by Infineon Technologies, this memory chip is designed to meet the demanding requirements of high-speed data buffering and storage across various industrial applications. With its large storage capacity and fast access times, it is ideal for applications requiring quick data retrieval and high throughput, ensuring that systems operate efficiently and reliably.
CY7C1413JV18-300BZXC Features
This SRAM IC boasts a 36Mbit capacity with a parallel interface, providing a balance of speed and accessibility. The 165FBGA packaging not only minimizes space on the circuit board but also enhances the thermal management and reliability of the device. Suitable for rigorous industrial environments, it supports a wide temperature range and has a data retention voltage designed for low power consumption and stable performance.
CY7C1413JV18-300BZXC Applications
- Networking Equipment: Utilized in routers and switches for packet buffering, ensuring efficient data flow and reduced latency.
- Telecommunications: Critical in telecommunications infrastructure for fast data access and real-time signal processing.
- Industrial Automation: Serves as a reliable memory solution in automation controllers, enhancing the processing capabilities and response times of automation systems.
- Automotive: Employed in advanced driver-assistance systems (ADAS) to handle large volumes of data from vehicle sensors efficiently.
- Aerospace: Integral to flight control systems, where quick access to data is crucial for system stability and safety.
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