CY7C1413JV18-250BZI
- Mfr.Part #
- CY7C1413JV18-250BZI
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 165FBGA
- Stock
- 18,801
- In Stock :
- 18,801
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Number of Terminations :
- 165
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Functions :
- 1
- Supply Voltage-Min (Vsup) :
- 1.7V
- Access Time (Max) :
- 0.45 ns
- Memory Density :
- 37748736 bit
- Organization :
- 2MX18
- Pin Count :
- 165
- Terminal Position :
- BOTTOM
- Memory Type :
- Volatile
- Terminal Pitch :
- 1mm
- Width :
- 15mm
- Height Seated (Max) :
- 1.4mm
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 1.7V~1.9V
- Qualification Status :
- COMMERCIAL
- Packaging :
- Tray
- Memory Width :
- 18
- Supply Voltage :
- 1.8V
- Additional Feature :
- PIPELINED ARCHITECTURE
- Length :
- 17mm
- Clock Frequency :
- 250MHz
- Supply Voltage-Max (Vsup) :
- 1.9V
- Memory Interface :
- Parallel
- Reach Compliance Code :
- Unknown
- Package / Case :
- 165-LBGA
- Memory Size :
- 36Mb 2M x 18
- Surface Mount :
- yes
- JESD-30 Code :
- R-PBGA-B165
- Memory Format :
- SRAM
- RoHS Status :
- Non-RoHS Compliant
- Operating Temperature :
- -40°C~85°C TA
- Datasheets
- CY7C1413JV18-250BZI

Memory Infineon Technologies CY7C1413JV18-250BZI Overview
The Memory Infineon Technologies CY7C1413JV18-250BZI is a high-performance 36Mbit SRAM chip, delivered in a compact 165FBGA package. Engineered by Infineon Technologies, this IC is designed for applications requiring fast access and high reliability. Its parallel interface ensures robust data transfer rates which are essential for advanced industrial applications. The product's high density and reliability make it an ideal choice for sophisticated electronics requiring a substantial memory buffer in a restricted space.
CY7C1413JV18-250BZI Features
This SRAM IC features a 36Mbit capacity with a parallel interface, providing high-speed access and data integrity. The 165FBGA packaging is optimized for compact designs, enhancing thermal stability and reducing the overall footprint. The device operates efficiently across a wide range of temperatures, making it suitable for demanding industrial environments.
CY7C1413JV18-250BZI Applications
- Networking Equipment: Used in routers and switches for packet buffering, ensuring efficient data flow and speed.
- High-performance Computing: Facilitates quick data access for processors in supercomputers and data centers, improving processing times and reliability.
- Automotive Electronics: Integral for advanced driver-assistance systems (ADAS) where rapid data retrieval is necessary for real-time decision making.
- Telecommunications: Helps in managing data transmission and signal processing tasks within telecom infrastructures.
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Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
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