CY7C1413BV18-250BZC

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Mfr.Part #
CY7C1413BV18-250BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165FBGA
Stock
374
In Stock :
374

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Number of Terminations :
165
Organization :
2MX18
Reach Compliance Code :
Unknown
Package / Case :
165-LBGA
Pin Count :
165
Length :
17mm
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Type :
Volatile
Supply Voltage-Max (Vsup) :
1.9V
Memory Width :
18
Supply Voltage :
1.8V
Qualification Status :
COMMERCIAL
Packaging :
Tray
Terminal Position :
BOTTOM
Memory Interface :
Parallel
Mounting Type :
Surface Mount
Terminal Finish :
TIN LEAD
Height Seated (Max) :
1.4mm
Width :
15mm
Number of Functions :
1
RoHS Status :
Non-RoHS Compliant
Clock Frequency :
250MHz
Memory Format :
SRAM
Voltage - Supply :
1.7V~1.9V
JESD-30 Code :
R-PBGA-B165
Access Time (Max) :
0.45 ns
Terminal Pitch :
1mm
Supply Voltage-Min (Vsup) :
1.7V
Additional Feature :
PIPELINED ARCHITECTURE
JESD-609 Code :
e0
Operating Temperature :
0°C~70°C TA
Memory Density :
37748736 bit
Memory Size :
36Mb 2M x 18
Introducing Memory Infineon Technologies CY7C1413BV18-250BZC from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:165, Package / Case:165-LBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, CY7C1413BV18-250BZC pinout, CY7C1413BV18-250BZC datasheet PDF, CY7C1413BV18-250BZC amp .Beyond Memory Infineon Technologies CY7C1413BV18-250BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1413BV18-250BZC


Memory Infineon Technologies CY7C1413BV18-250BZC Overview

The Memory Infineon Technologies CY7C1413BV18-250BZC is a high-performance 36Mbit SRAM component designed for applications requiring fast access and high data bandwidth. Manufactured by Infineon Technologies, this IC leverages advanced 165FBGA packaging technology to ensure reliability and durability in demanding environments. With its robust parallel interface, it meets the critical needs of sophisticated digital systems, making it an ideal solution for designers seeking efficient, high-speed memory operations.

CY7C1413BV18-250BZC Features

This SRAM IC features a dense 36Mbit capacity, providing substantial space for high-speed data storage and retrieval. The parallel interface ensures compatibility with a wide range of hardware, facilitating easy integration into existing architectures. Additionally, the 165FBGA package enhances thermal stability and reduces the footprint, making it suitable for compact devices where space is at a premium.

CY7C1413BV18-250BZC Applications

  • Networking Equipment: Utilized in routers and switches to manage data flow efficiently, ensuring high-speed data processing and improved network performance.
  • Telecommunications: Integral for telecommunications equipment, where rapid access to buffer memory is crucial for handling large volumes of voice and data traffic.
  • Automotive Electronics: Supports advanced driver-assistance systems (ADAS) by providing fast data access necessary for real-time decision making.
  • Industrial Automation: Ideal for use in automated control systems in factories where quick data retrieval helps enhance machine operation and system responsiveness.
  • Medical Devices: Employed in medical imaging systems, enabling quick access to large data sets necessary for high-resolution imaging.
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