CY7C1413BV18-200BZC

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Mfr.Part #
CY7C1413BV18-200BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165FBGA
Stock
6
In Stock :
6

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Memory Format :
SRAM
Memory Size :
36Mb 2M x 18
Package / Case :
165-LBGA
RoHS Status :
Non-RoHS Compliant
Clock Frequency :
200MHz
Supply Voltage :
1.8V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
15mm
Reach Compliance Code :
Unknown
Organization :
2MX18
Packaging :
Tray
Operating Temperature :
0°C~70°C TA
Access Time (Max) :
0.45 ns
Qualification Status :
COMMERCIAL
Length :
17mm
Memory Density :
37748736 bit
Memory Type :
Volatile
Surface Mount :
yes
Terminal Position :
BOTTOM
JESD-609 Code :
e0
Voltage - Supply :
1.7V~1.9V
Height Seated (Max) :
1.4mm
JESD-30 Code :
R-PBGA-B165
Mounting Type :
Surface Mount
Additional Feature :
PIPELINED ARCHITECTURE
Supply Voltage-Max (Vsup) :
1.9V
Number of Terminations :
165
Pin Count :
165
Supply Voltage-Min (Vsup) :
1.7V
Terminal Pitch :
1mm
Memory Interface :
Parallel
Memory Width :
18
Number of Functions :
1
Terminal Finish :
TIN LEAD
Introducing Memory Infineon Technologies CY7C1413BV18-200BZC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Number of Terminations:165, CY7C1413BV18-200BZC pinout, CY7C1413BV18-200BZC datasheet PDF, CY7C1413BV18-200BZC amp .Beyond Memory Infineon Technologies CY7C1413BV18-200BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1413BV18-200BZC


Memory Infineon Technologies CY7C1413BV18-200BZC Overview

The Memory Infineon Technologies CY7C1413BV18-200BZC is a high-performance IC SRAM designed to meet the demanding requirements of sophisticated electronic systems. With a substantial storage capacity of 36Mbit and a fast access speed facilitated by its parallel interface, this SRAM chip from Infineon Technologies is an ideal solution for applications requiring rapid and reliable data storage and retrieval. Engineered in a compact 165FBGA package, it offers robust performance in a variety of environmental conditions, making it a versatile choice for technology innovators and system designers aiming to optimize their hardware solutions for both efficiency and power.

CY7C1413BV18-200BZC Features

This specific model boasts several compelling features, including a dense 36Mbit memory capacity and a swift operational speed of 200MHz, which ensures high throughput for data-intensive applications. Its parallel interface architecture allows for quick and efficient data transfer, critical for high-speed computing tasks. The 165FBGA packaging not only reduces the physical footprint but also enhances the thermal management and reliability of the device under varying operational conditions.

CY7C1413BV18-200BZC Applications

  • Networking Equipment: Utilized in routers and switches to manage data flow efficiently, ensuring high-speed data processing and reliability in communication infrastructures.
  • High-Performance Computing (HPC): Ideal for use in servers and supercomputers where large volumes of data require rapid access and storage, enhancing overall system performance.
  • Automotive: Used in advanced driver-assistance systems (ADAS) to quickly process information from vehicle sensors, contributing to safer driving dynamics and enhanced vehicle responsiveness.
  • Telecommunications: Employed in telecom infrastructure to facilitate the rapid processing and storage of information, crucial for maintaining system integrity and operational efficiency in high-demand scenarios.
  • Industrial Automation: Integral to control systems in manufacturing processes where speed and data integrity are critical for maintaining high levels of productivity and operational safety.
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Shipping Cost

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