CY7C1412BV18-250BZC
- Mfr.Part #
- CY7C1412BV18-250BZC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 165FBGA
- Stock
- 24,176
- In Stock :
- 24,176
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Supply Voltage :
- 1.8V
- Memory Type :
- Volatile
- Mounting Type :
- Surface Mount
- Published :
- 2003
- Supply Current-Max :
- 0.85mA
- Surface Mount :
- yes
- Width :
- 15mm
- RoHS Status :
- Non-RoHS Compliant
- Number of Terminations :
- 165
- I/O Type :
- Separate
- Memory Format :
- SRAM
- Height Seated (Max) :
- 1.4mm
- Voltage - Supply :
- 1.7V~1.9V
- HTS Code :
- 8542.32.00.41
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Pins :
- 165
- Organization :
- 2MX18
- Access Time :
- 450 ps
- Clock Frequency :
- 250MHz
- Supply Voltage-Max (Vsup) :
- 1.9V
- Qualification Status :
- Not Qualified
- Power Supplies :
- 1.5/1.81.8V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- JESD-609 Code :
- e0
- Reach Compliance Code :
- not_compliant
- Terminal Position :
- BOTTOM
- Memory Width :
- 18
- Number of Functions :
- 1
- Standby Voltage-Min :
- 1.7V
- Operating Temperature :
- 0°C~70°C TA
- ECCN Code :
- 3A991.B.2.A
- Memory Size :
- 36Mb 2M x 18
- Output Characteristics :
- 3-STATE
- Supply Voltage-Min (Vsup) :
- 1.7V
- Package / Case :
- 165-LBGA
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 220
- Standby Current-Max :
- 0.42A
- Base Part Number :
- CY7C1412
- Terminal Pitch :
- 1mm
- Terminal Finish :
- TIN LEAD
- Additional Feature :
- PIPELINED ARCHITECTURE
- Memory Interface :
- Parallel
- Pin Count :
- 165
- Memory Density :
- 37748736 bit
- Length :
- 17mm
- Datasheets
- CY7C1412BV18-250BZC

Memory Infineon Technologies CY7C1412BV18-250BZC Overview
The Memory Infineon Technologies CY7C1412BV18-250BZC is a high-performance 36Mbit SRAM module, housed in a compact 165FBGA package. This device from Infineon Technologies offers swift parallel interface capabilities, catering to applications requiring rapid access and high bandwidth. Engineered for reliability and high-speed operation, it is particularly suitable for advanced computing and industrial applications where speed and stability are critical. The Memory Infineon Technologies CY7C1412BV18-250BZC stands out in the market for its robust data integrity and low latency features.
CY7C1412BV18-250BZC Features
- 36Mbit high-density SRAM for extensive data storage
- Parallel interface for faster data transfer rates
- 165FBGA package ensures a compact form factor and reduced space requirement
- Designed for low power consumption and high reliability
- Supports a wide range of operating temperatures, making it versatile for various industrial applications
CY7C1412BV18-250BZC Applications
- Advanced Computing Systems: Utilized in servers and high-performance computing platforms for fast data buffering and processing.
- Networking Equipment: Key component in routers, switches, and network cards for managing data flow efficiently.
- Telecommunication Systems: Supports high-speed data transmission and storage in telecommunications infrastructure.
- Automotive Electronics: Ideal for use in advanced driver-assistance systems (ADAS) where rapid data access is essential.
- Industrial Automation: Enhances performance in automation controls and real-time industrial systems.
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