CY7C1393BV18-167BZC

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Mfr.Part #
CY7C1393BV18-167BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
7,759
In Stock :
7,759

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Height Seated (Max) :
1.4mm
Voltage - Supply :
1.7V~1.9V
Clock Frequency :
167MHz
Length :
15mm
Pin Count :
165
Additional Feature :
PIPELINED ARCHITECTURE
Organization :
1MX18
Supply Voltage-Min (Vsup) :
1.7V
Standby Voltage-Min :
1.7V
Published :
2003
Sync/Async :
SYNCHRONOUS
Number of Pins :
165
Operating Temperature :
0°C~70°C TA
Memory Interface :
Parallel
Number of Terminations :
165
Peak Reflow Temperature (Cel) :
220
Mount :
Surface Mount
Supply Voltage-Max (Vsup) :
1.9V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Lead Free :
Contains Lead
Mounting Type :
Surface Mount
Output Characteristics :
3-STATE
Number of Functions :
1
Terminal Finish :
Tin/Lead (Sn/Pb)
Qualification Status :
Not Qualified
JESD-609 Code :
e0
Number of Ports :
2
Reach Compliance Code :
not_compliant
Memory Width :
18
Packaging :
Tray
Memory Size :
18Mb 1M x 18
Access Time :
500 ps
Supply Voltage :
1.8V
Package / Case :
165-LBGA
Address Bus Width :
19b
Base Part Number :
CY7C1393
Terminal Position :
BOTTOM
Nominal Supply Current :
500mA
Operating Supply Voltage :
1.8V
Terminal Pitch :
1mm
Memory Format :
SRAM
Memory Type :
Volatile
I/O Type :
Separate
RoHS Status :
Non-RoHS Compliant
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Density :
18 Mb
Word Size :
18b
Introducing Memory Infineon Technologies CY7C1393BV18-167BZC from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:165, Operating Temperature:0°C~70°C TA, Number of Terminations:165, Mounting Type:Surface Mount, Package / Case:165-LBGA, Base Part Number:CY7C1393, CY7C1393BV18-167BZC pinout, CY7C1393BV18-167BZC datasheet PDF, CY7C1393BV18-167BZC amp .Beyond Memory Infineon Technologies CY7C1393BV18-167BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1393BV18-167BZC


Memory Infineon Technologies CY7C1393BV18-167BZC Overview

Optimized for high-speed performance and reliability, the Memory Infineon Technologies CY7C1393BV18-167BZC SRAM module offers an essential solution for advanced data storage systems. This integrated circuit boasts an 18Mbit capacity with a parallel interface, housed in a compact 165FBGA package, ensuring high-density integration while maintaining low power consumption and high-speed access. This product's robust design and advanced technology make it a perfect fit for demanding applications, aiming to meet the rigorous requirements of contemporary digital systems. Ideal for businesses looking to invest in top-tier memory components, the CY7C1393BV18-167BZC provides efficiency and reliability, promoting enhanced system performance.

CY7C1393BV18-167BZC Features

The CY7C1393BV18-167BZC from Infineon Technologies features an 18Mbit storage capacity with a fast parallel interface, ensuring swift data access and processing. Encased in a 165FBGA package, it offers optimal heat dissipation and space efficiency, making it ideal for compact systems. The SRAM's low power consumption and minimal latency are crucial for high-performance applications, providing dependable and continuous service without compromising on speed or power efficiency.

CY7C1393BV18-167BZC Applications

  • Networking Equipment: Utilized in routers and switches for buffering data, enhancing the efficiency of data flow and speed in network communications.
  • High-Performance Computing: Supports processing in supercomputers and data centers, where speed and data integrity are paramount.
  • Automotive Electronics: Employed in advanced driver-assistance systems (ADAS) to ensure rapid data processing and response times, critical for safety and performance.
  • Industrial Automation: Integral in control systems for real-time processing and handling of large data volumes, ensuring operational precision and reliability.
  • Medical Devices: Used in medical imaging systems like MRIs and CT scanners, where large amounts of data must be quickly and reliably processed to produce accurate imaging results.
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