CY7C1393BV18-167BZC
- Mfr.Part #
- CY7C1393BV18-167BZC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165FBGA
- Stock
- 7,759
- In Stock :
- 7,759
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Height Seated (Max) :
- 1.4mm
- Voltage - Supply :
- 1.7V~1.9V
- Clock Frequency :
- 167MHz
- Length :
- 15mm
- Pin Count :
- 165
- Additional Feature :
- PIPELINED ARCHITECTURE
- Organization :
- 1MX18
- Supply Voltage-Min (Vsup) :
- 1.7V
- Standby Voltage-Min :
- 1.7V
- Published :
- 2003
- Sync/Async :
- SYNCHRONOUS
- Number of Pins :
- 165
- Operating Temperature :
- 0°C~70°C TA
- Memory Interface :
- Parallel
- Number of Terminations :
- 165
- Peak Reflow Temperature (Cel) :
- 220
- Mount :
- Surface Mount
- Supply Voltage-Max (Vsup) :
- 1.9V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Lead Free :
- Contains Lead
- Mounting Type :
- Surface Mount
- Output Characteristics :
- 3-STATE
- Number of Functions :
- 1
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Qualification Status :
- Not Qualified
- JESD-609 Code :
- e0
- Number of Ports :
- 2
- Reach Compliance Code :
- not_compliant
- Memory Width :
- 18
- Packaging :
- Tray
- Memory Size :
- 18Mb 1M x 18
- Access Time :
- 500 ps
- Supply Voltage :
- 1.8V
- Package / Case :
- 165-LBGA
- Address Bus Width :
- 19b
- Base Part Number :
- CY7C1393
- Terminal Position :
- BOTTOM
- Nominal Supply Current :
- 500mA
- Operating Supply Voltage :
- 1.8V
- Terminal Pitch :
- 1mm
- Memory Format :
- SRAM
- Memory Type :
- Volatile
- I/O Type :
- Separate
- RoHS Status :
- Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Density :
- 18 Mb
- Word Size :
- 18b
- Datasheets
- CY7C1393BV18-167BZC

Memory Infineon Technologies CY7C1393BV18-167BZC Overview
Optimized for high-speed performance and reliability, the Memory Infineon Technologies CY7C1393BV18-167BZC SRAM module offers an essential solution for advanced data storage systems. This integrated circuit boasts an 18Mbit capacity with a parallel interface, housed in a compact 165FBGA package, ensuring high-density integration while maintaining low power consumption and high-speed access. This product's robust design and advanced technology make it a perfect fit for demanding applications, aiming to meet the rigorous requirements of contemporary digital systems. Ideal for businesses looking to invest in top-tier memory components, the CY7C1393BV18-167BZC provides efficiency and reliability, promoting enhanced system performance.
CY7C1393BV18-167BZC Features
The CY7C1393BV18-167BZC from Infineon Technologies features an 18Mbit storage capacity with a fast parallel interface, ensuring swift data access and processing. Encased in a 165FBGA package, it offers optimal heat dissipation and space efficiency, making it ideal for compact systems. The SRAM's low power consumption and minimal latency are crucial for high-performance applications, providing dependable and continuous service without compromising on speed or power efficiency.
CY7C1393BV18-167BZC Applications
- Networking Equipment: Utilized in routers and switches for buffering data, enhancing the efficiency of data flow and speed in network communications.
- High-Performance Computing: Supports processing in supercomputers and data centers, where speed and data integrity are paramount.
- Automotive Electronics: Employed in advanced driver-assistance systems (ADAS) to ensure rapid data processing and response times, critical for safety and performance.
- Industrial Automation: Integral in control systems for real-time processing and handling of large data volumes, ensuring operational precision and reliability.
- Medical Devices: Used in medical imaging systems like MRIs and CT scanners, where large amounts of data must be quickly and reliably processed to produce accurate imaging results.
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