CY7C1387D-167BZI

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Mfr.Part #
CY7C1387D-167BZI
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
43,440
In Stock :
43,440

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Address Bus Width :
20b
Pbfree Code :
No
Density :
18 Mb
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Pitch :
1mm
Published :
2004
Memory Format :
SRAM
Terminal Position :
BOTTOM
Clock Frequency :
167MHz
Mounting Type :
Surface Mount
Radiation Hardening :
No
JESD-609 Code :
e0
Operating Supply Voltage :
3.3V
Packaging :
Tray
Supply Voltage :
3.3V
Word Size :
18b
Organization :
1MX18
Peak Reflow Temperature (Cel) :
220
RoHS Status :
Non-RoHS Compliant
Terminal Finish :
Tin/Lead (Sn/Pb)
Base Part Number :
CY7C1387
Number of Functions :
1
I/O Type :
COMMON
Voltage - Supply :
3.135V~3.6V
Mount :
Surface Mount
Nominal Supply Current :
275mA
Sync/Async :
SYNCHRONOUS
Memory Width :
18
Package / Case :
165-LBGA
Additional Feature :
PIPELINED ARCHITECTURE
Length :
15mm
Output Characteristics :
3-STATE
Operating Temperature :
0°C~70°C TA
Number of Pins :
165
Number of Terminations :
165
Standby Voltage-Min :
3.14V
Height Seated (Max) :
1.4mm
Number of Ports :
2
Memory Size :
18Mb 1M x 18
Pin Count :
165
Supply Voltage-Max (Vsup) :
3.6V
Standby Current-Max :
0.07A
Memory Type :
Volatile
Memory Interface :
Parallel
Access Time :
3.4ns
Supply Voltage-Min (Vsup) :
3.135V
Datasheets
CY7C1387D-167BZI
Introducing Memory Infineon Technologies CY7C1387D-167BZI from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:CY7C1387, Package / Case:165-LBGA, Operating Temperature:0°C~70°C TA, Number of Pins:165, Number of Terminations:165, CY7C1387D-167BZI pinout, CY7C1387D-167BZI datasheet PDF, CY7C1387D-167BZI amp .Beyond Memory Infineon Technologies CY7C1387D-167BZI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1387D-167BZI


[Memory Infineon Technologies CY7C1387D-167BZI] Overview

Introducing the cutting-edge Memory Infineon Technologies CY7C1387D-167BZI, a high-performance Integrated Circuit (IC) designed to revolutionize data storage solutions. With its unparalleled capacity and lightning-fast parallel processing capabilities, this IC SRAM 18MBIT Parallel 165FBGA is set to redefine industry standards.

Infineon Technologies, a renowned leader in semiconductor innovation, brings forth this exceptional product, engineered to meet the rigorous demands of modern data-driven applications. Whether it's for industrial automation, telecommunications, or automotive systems, this IC delivers unmatched reliability and performance.

CY7C1387D-167BZI Features

  • High-Capacity Storage: With an impressive 18MBIT capacity, this IC provides ample space for storing critical data.
  • Parallel Processing: The parallel architecture enhances data processing speed, enabling rapid retrieval and transmission of information.
  • Compact Design: Housed in a 165FBGA package, this IC offers space-efficient integration into various electronic devices.
  • Low Power Consumption: Despite its powerful performance, this IC maintains energy efficiency, reducing overall power consumption.
  • Robust Reliability: Engineered by Infineon Technologies, renowned for quality, this IC ensures long-term reliability in diverse operating conditions.

CY7C1387D-167BZI Applications

  • Industrial Automation: Employed in PLCs (Programmable Logic Controllers) and CNC (Computer Numerical Control) machines, this IC facilitates high-speed data processing, enabling precise control and monitoring of industrial processes.
  • Telecommunications: Integrated into network routers and switches, this IC enhances data transmission efficiency, ensuring seamless communication in telecommunications networks.
  • Automotive Systems: Utilized in automotive ECUs (Engine Control Units) and infotainment systems, this IC enables fast data access and processing, enhancing vehicle performance and connectivity.
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Shipping Cost

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