CY7C1382C-200BZC

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Mfr.Part #
CY7C1382C-200BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
CACHE SRAM, 1MX18, 3NS
Stock
46
In Stock :
46

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Memory Width :
18
Qualification Status :
COMMERCIAL
RoHS :
Compliant
Terminal Finish :
TIN LEAD
Technology :
SRAM - Synchronous, SDR
Clock Frequency :
200 MHz
Mounting Type :
Surface Mount
Supplier Device Package :
165-FBGA (13x15)
Memory IC Type :
CACHE SRAM
Write Cycle Time - Word, Page :
-
Terminal Form :
Ball
Package Shape :
RECTANGULAR
Memory Size :
18Mbit
Manufacturer :
Rochester Electronics LLC
Memory Organization :
512K x 36
Terminal Pitch :
1 mm
Supply Voltage-Max (Vsup) :
3.6 V
Seated Height-Max :
1.2 mm
Operating Mode :
SYNCHRONOUS
Memory Type :
Volatile
Peak Reflow Temperature (Cel) :
220
Memory Density :
18874368 bit
Access Time :
3 ns
Supply Voltage-Min (Vsup) :
3.135 V
Package :
Bulk
Memory Interface :
Parallel
Length :
15 mm
Reach Compliance Code :
Unknown
JESD-30 Code :
R-PBGA-B165
Width :
13 mm
Operating Temperature :
0°C ~ 70°C (TA)
Temperature Grade :
COMMERCIAL
Base Product Number :
CY7C1382
Organization :
1MX18
Number of Functions :
1
Pbfree Code :
No
Package / Case :
165-LBGA
Additional Feature :
PIPELINED ARCHITECTURE
Pin Count :
165
Terminal Position :
BOTTOM
Parallel/Serial :
Parallel
Memory Format :
SRAM
JESD-609 Code :
e0
Voltage - Supply :
3.135V ~ 3.6V
Number of Words :
1048576 words
Surface Mount :
yes
Product Status :
Active
Number of Terminals :
165
Series :
-
Datasheets
CY7C1382C-200BZC
Introducing Memory Infineon Technologies CY7C1382C-200BZC from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C ~ 70°C (TA), Package / Case:165-LBGA, CY7C1382C-200BZC pinout, CY7C1382C-200BZC datasheet PDF, CY7C1382C-200BZC amp .Beyond Memory Infineon Technologies CY7C1382C-200BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1382C-200BZC


Memory Infineon Technologies CY7C1382C-200BZC Overview

The Memory Infineon Technologies CY7C1382C-200BZC is a high-performance CACHE SRAM designed to meet the stringent demands of high-speed computing and advanced digital systems. Manufactured by Infineon Technologies, this SRAM features a 1M x 18 memory array which delivers fast access times as low as 3 nanoseconds, making it an ideal choice for applications requiring rapid data retrieval and high bandwidth. Its robust architecture and reliability make it suitable for intensive applications in a variety of sectors including telecommunications, computing, and industrial markets.

CY7C1382C-200BZC Features

This CACHE SRAM chip boasts several key features that enhance its performance and usability:

  • High-Speed Access: With access times as short as 3ns, this memory component ensures minimal latency in data retrieval, crucial for high-speed operations.
  • Large Capacity: The 1M x 18 configuration provides ample storage for applications that require large amounts of fast-access memory.
  • Durability: Designed by Infineon Technologies, a leader in semiconductor innovation, the reliability and durability of this SRAM are ensured under a variety of environmental conditions.
  • Compatibility: It is engineered to be compatible with a wide range of industrial and commercial devices, enhancing its application scope.

CY7C1382C-200BZC Applications

  • Advanced Computing Systems: Utilized in server farms and high-performance computing environments where speed and reliability are critical.
  • Telecommunications Equipment: Ideal for use in routers and switches where fast memory access is necessary to handle large volumes of data traffic efficiently.
  • Industrial Automation: Applied in control systems that require quick data fetching to maintain consistent operational workflows.
  • Aerospace and Defense: Used in applications requiring rugged memory solutions that can withstand extreme conditions while maintaining data integrity.
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