CY7C1380DV33-200BZI

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Mfr.Part #
CY7C1380DV33-200BZI
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
224
In Stock :
224

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Memory Type :
Volatile
Memory Format :
SRAM
Packaging :
Tray
Voltage - Supply :
3.135V~3.6V
Memory Interface :
Parallel
Package / Case :
165-LBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
-40°C~85°C TA
Clock Frequency :
200MHz
Memory Size :
18Mb 512K x 36
Access Time :
3ns
Mounting Type :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Supplier Device Package :
165-FBGA (13x15)
Introducing Memory Infineon Technologies CY7C1380DV33-200BZI from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, CY7C1380DV33-200BZI pinout, CY7C1380DV33-200BZI datasheet PDF, CY7C1380DV33-200BZI amp .Beyond Memory Infineon Technologies CY7C1380DV33-200BZI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1380DV33-200BZI


Memory Infineon Technologies CY7C1380DV33-200BZI Overview

The Memory Infineon Technologies CY7C1380DV33-200BZI is a cutting-edge integrated circuit specifically designed for high-performance computing solutions requiring robust data retention capabilities. This SRAM device features a substantial 18Mbit capacity and is packaged in a compact 165FBGA configuration, making it ideal for applications where space and power efficiency are critical. The high-speed interface supports up to 200 MHz clock frequency, ensuring rapid access and processing of data which is essential for modern electronic systems. With its high reliability and advanced technology provided by Infineon Technologies, this product stands out as a superior choice for designers looking to enhance system capabilities with minimal latency and maximal durability.

CY7C1380DV33-200BZI Features

This SRAM chip offers a parallel interface, enabling quick data transfer rates that are essential for high-speed operations. The device's 18Mbit capacity allows for substantial data storage, suitable for buffering and caching in complex computations. Its 165FBGA package is not only space-efficient but also optimized for thermal stability and reduced power consumption, enhancing the overall efficiency of electronic assemblies.

CY7C1380DV33-200BZI Applications

  • Advanced Networking Equipment: Utilizes the high-speed data access to handle large-scale data packets efficiently, crucial for routers and switches.
  • High-Performance Computing: Provides the necessary speed and capacity for temporary data storage in servers and computational clusters, facilitating fast processing and throughput.
  • Automotive Electronics: Employs robust data retention and quick access capabilities, essential for real-time processing in vehicle control systems.
  • Industrial Automation: Supports complex automation tasks by managing multiple data inputs and outputs swiftly, ensuring seamless operations in manufacturing processes.
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