CY7C1370KV33-200BZXI
- Mfr.Part #
- CY7C1370KV33-200BZXI
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165FBGA
- Stock
- 37
- In Stock :
- 37
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Packaging :
- Tray
- JESD-30 Code :
- R-PBGA-B165
- Terminal Position :
- BOTTOM
- Clock Frequency :
- 200MHz
- Length :
- 15mm
- Number of Terminations :
- 165
- Supply Voltage-Max (Vsup) :
- 3.6V
- Operating Temperature :
- -40°C~85°C TA
- Terminal Pitch :
- 1mm
- Mounting Type :
- Surface Mount
- Memory Size :
- 18Mb 512K x 36
- Additional Feature :
- PIPELINED ARCHITECTURE
- Package / Case :
- 165-LBGA
- Height Seated (Max) :
- 1.4mm
- Access Time :
- 3ns
- HTS Code :
- 8542.32.00.41
- Supply Voltage :
- 3.3V
- Series :
- NoBL™
- Memory Interface :
- Parallel
- ECCN Code :
- 3A991.B.2.B
- Memory Width :
- 36
- Memory Type :
- Volatile
- Surface Mount :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Functions :
- 1
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Density :
- 18874368 bit
- Supply Voltage-Min (Vsup) :
- 3.135V
- Memory Format :
- SRAM
- RoHS Status :
- ROHS3 Compliant
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Organization :
- 512KX36
- Factory Lead Time :
- 6 Weeks
- Width :
- 13mm
- Voltage - Supply :
- 3.135V~3.6V
- Datasheets
- CY7C1370KV33-200BZXI

Memory Infineon Technologies CY7C1370KV33-200BZXI Overview
The CY7C1370KV33-200BZXI by Infineon Technologies is a high-performance IC SRAM designed to meet the demanding requirements of advanced computing and high-speed networking environments. With an 18Mbit capacity and parallel interface, this memory module, encapsulated in a compact 165FBGA package, offers robust data storage and quick access times, making it ideal for applications that require rapid processing and reliability. Integrating this Memory Infineon Technologies CY7C1370KV33-200BZXI into your systems ensures enhanced system performance due to its superior architecture and high data bandwidth capabilities.
CY7C1370KV33-200BZXI Features
This SRAM chip boasts a variety of features that make it a versatile choice for many technological applications. Key features include its 18Mbit capacity and fast access time, offered in a standard 165FBGA package. It supports a wide operating temperature range, which ensures stability and reliability across different environments. Additionally, its parallel interface facilitates higher throughput and faster communication speeds, crucial for high-performance computing tasks.
CY7C1370KV33-200BZXI Applications
- High-Performance Computing: Utilized in servers and workstations to manage large datasets and complex calculations efficiently.
- Networking Equipment: Ideal for use in routers and switches, enhancing data flow management and storage within network infrastructures.
- Telecommunications: Supports the needs of telecommunications equipment by providing reliable, high-speed memory for signal processing.
- Automotive Systems: Used in advanced automotive electronics where quick access to data is necessary for real-time system responses.
- Industrial Automation: Enhances the capability of control systems in industrial automation by speeding up data processing and response times.
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