CY7C1370KV33-200BZXI

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Mfr.Part #
CY7C1370KV33-200BZXI
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
37
In Stock :
37

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Packaging :
Tray
JESD-30 Code :
R-PBGA-B165
Terminal Position :
BOTTOM
Clock Frequency :
200MHz
Length :
15mm
Number of Terminations :
165
Supply Voltage-Max (Vsup) :
3.6V
Operating Temperature :
-40°C~85°C TA
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
Memory Size :
18Mb 512K x 36
Additional Feature :
PIPELINED ARCHITECTURE
Package / Case :
165-LBGA
Height Seated (Max) :
1.4mm
Access Time :
3ns
HTS Code :
8542.32.00.41
Supply Voltage :
3.3V
Series :
NoBL™
Memory Interface :
Parallel
ECCN Code :
3A991.B.2.B
Memory Width :
36
Memory Type :
Volatile
Surface Mount :
yes
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Functions :
1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Density :
18874368 bit
Supply Voltage-Min (Vsup) :
3.135V
Memory Format :
SRAM
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Organization :
512KX36
Factory Lead Time :
6 Weeks
Width :
13mm
Voltage - Supply :
3.135V~3.6V
Introducing Memory Infineon Technologies CY7C1370KV33-200BZXI from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:165, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Package / Case:165-LBGA, CY7C1370KV33-200BZXI pinout, CY7C1370KV33-200BZXI datasheet PDF, CY7C1370KV33-200BZXI amp .Beyond Memory Infineon Technologies CY7C1370KV33-200BZXI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1370KV33-200BZXI


Memory Infineon Technologies CY7C1370KV33-200BZXI Overview

The CY7C1370KV33-200BZXI by Infineon Technologies is a high-performance IC SRAM designed to meet the demanding requirements of advanced computing and high-speed networking environments. With an 18Mbit capacity and parallel interface, this memory module, encapsulated in a compact 165FBGA package, offers robust data storage and quick access times, making it ideal for applications that require rapid processing and reliability. Integrating this Memory Infineon Technologies CY7C1370KV33-200BZXI into your systems ensures enhanced system performance due to its superior architecture and high data bandwidth capabilities.

CY7C1370KV33-200BZXI Features

This SRAM chip boasts a variety of features that make it a versatile choice for many technological applications. Key features include its 18Mbit capacity and fast access time, offered in a standard 165FBGA package. It supports a wide operating temperature range, which ensures stability and reliability across different environments. Additionally, its parallel interface facilitates higher throughput and faster communication speeds, crucial for high-performance computing tasks.

CY7C1370KV33-200BZXI Applications

  • High-Performance Computing: Utilized in servers and workstations to manage large datasets and complex calculations efficiently.
  • Networking Equipment: Ideal for use in routers and switches, enhancing data flow management and storage within network infrastructures.
  • Telecommunications: Supports the needs of telecommunications equipment by providing reliable, high-speed memory for signal processing.
  • Automotive Systems: Used in advanced automotive electronics where quick access to data is necessary for real-time system responses.
  • Industrial Automation: Enhances the capability of control systems in industrial automation by speeding up data processing and response times.
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