CY7C1370DV25-167BZI
- Mfr.Part #
- CY7C1370DV25-167BZI
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165FBGA
- Stock
- 8,362
- In Stock :
- 8,362
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Voltage - Supply :
- 2.375V~2.625V
- Nominal Supply Current :
- 275mA
- ECCN Code :
- 3A991.B.2.A
- Packaging :
- Tray
- Lead Free :
- Contains Lead
- Clock Frequency :
- 167MHz
- JESD-609 Code :
- e0
- Terminal Pitch :
- 1mm
- Supply Voltage-Max (Vsup) :
- 2.625V
- Number of Functions :
- 1
- Mount :
- Surface Mount
- Memory Width :
- 36
- Additional Feature :
- PIPELINED ARCHITECTURE
- Peak Reflow Temperature (Cel) :
- 220
- Mounting Type :
- Surface Mount
- Standby Voltage-Min :
- 2.38V
- Operating Temperature :
- -40°C~85°C TA
- Number of Terminations :
- 165
- Organization :
- 512KX36
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Memory Format :
- SRAM
- Access Time :
- 3.4ns
- Number of Pins :
- 165
- Base Part Number :
- CY7C1370
- Address Bus Width :
- 19b
- Density :
- 18 Mb
- Memory Interface :
- Parallel
- Qualification Status :
- Not Qualified
- Series :
- NoBL™
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Package / Case :
- 165-LBGA
- Supply Voltage-Min (Vsup) :
- 2.375V
- RoHS Status :
- Non-RoHS Compliant
- Sync/Async :
- SYNCHRONOUS
- Output Characteristics :
- 3-STATE
- Word Size :
- 36b
- Terminal Position :
- BOTTOM
- Pin Count :
- 165
- Supply Voltage :
- 2.5V
- Length :
- 15mm
- I/O Type :
- COMMON
- Reach Compliance Code :
- not_compliant
- Memory Size :
- 18Mb 512K x 36
- Standby Current-Max :
- 0.07A
- Published :
- 2006
- Operating Supply Voltage :
- 2.5V
- Memory Type :
- Volatile
- Number of Ports :
- 4
- Datasheets
- CY7C1370DV25-167BZI

Memory Infineon Technologies CY7C1370DV25-167BZI Overview
The Memory Infineon Technologies CY7C1370DV25-167BZI is a cutting-edge SRAM chip designed by Infineon Technologies, tailored for applications requiring high-speed, high-capacity storage. This IC features a substantial 18Mbit of parallel SRAM, housed within a compact 165FBGA package, making it an excellent choice for advanced digital systems that demand robust, low-latency memory solutions. The use of this specific model enhances system reliability and performance, which is crucial for B2B customers looking to deploy high-performance products at scale.
CY7C1370DV25-167BZI Features
This SRAM chip boasts a parallel interface, providing rapid access and write times, which is essential for high-speed computing applications. Its 165FBGA packaging is not only space-efficient but also offers improved thermal management and reduced electrical noise, enhancing overall system stability. Furthermore, the chip operates at a clock frequency of 167 MHz, which allows for efficient data handling in rigorous computing environments.
CY7C1370DV25-167BZI Applications
- Networking Equipment: Utilized in routers and switches, the CY7C1370DV25-167BZI provides the necessary speed and capacity for handling high volumes of data traffic efficiently.
- High-performance Computing: Serves as a critical component in workstations and servers where quick access to large amounts of data is required for processing complex computations.
- Telecommunications: Used in telecommunications infrastructure to ensure fast and reliable access to data, essential for real-time communication applications.
- Video Streaming Devices: Supports high-definition video streaming by facilitating fast data retrieval, crucial for reducing buffer times and enhancing viewer experience.
- Automotive Electronics: Applied in advanced driver-assistance systems (ADAS) where rapid data processing is essential for real-time decision making.
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