CY7C1370DV25-167BZI

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Mfr.Part #
CY7C1370DV25-167BZI
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
8,362
In Stock :
8,362

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Voltage - Supply :
2.375V~2.625V
Nominal Supply Current :
275mA
ECCN Code :
3A991.B.2.A
Packaging :
Tray
Lead Free :
Contains Lead
Clock Frequency :
167MHz
JESD-609 Code :
e0
Terminal Pitch :
1mm
Supply Voltage-Max (Vsup) :
2.625V
Number of Functions :
1
Mount :
Surface Mount
Memory Width :
36
Additional Feature :
PIPELINED ARCHITECTURE
Peak Reflow Temperature (Cel) :
220
Mounting Type :
Surface Mount
Standby Voltage-Min :
2.38V
Operating Temperature :
-40°C~85°C TA
Number of Terminations :
165
Organization :
512KX36
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Memory Format :
SRAM
Access Time :
3.4ns
Number of Pins :
165
Base Part Number :
CY7C1370
Address Bus Width :
19b
Density :
18 Mb
Memory Interface :
Parallel
Qualification Status :
Not Qualified
Series :
NoBL™
Terminal Finish :
Tin/Lead (Sn/Pb)
Package / Case :
165-LBGA
Supply Voltage-Min (Vsup) :
2.375V
RoHS Status :
Non-RoHS Compliant
Sync/Async :
SYNCHRONOUS
Output Characteristics :
3-STATE
Word Size :
36b
Terminal Position :
BOTTOM
Pin Count :
165
Supply Voltage :
2.5V
Length :
15mm
I/O Type :
COMMON
Reach Compliance Code :
not_compliant
Memory Size :
18Mb 512K x 36
Standby Current-Max :
0.07A
Published :
2006
Operating Supply Voltage :
2.5V
Memory Type :
Volatile
Number of Ports :
4
Datasheets
CY7C1370DV25-167BZI
Introducing Memory Infineon Technologies CY7C1370DV25-167BZI from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Number of Terminations:165, Number of Pins:165, Base Part Number:CY7C1370, Package / Case:165-LBGA, CY7C1370DV25-167BZI pinout, CY7C1370DV25-167BZI datasheet PDF, CY7C1370DV25-167BZI amp .Beyond Memory Infineon Technologies CY7C1370DV25-167BZI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1370DV25-167BZI


Memory Infineon Technologies CY7C1370DV25-167BZI Overview

The Memory Infineon Technologies CY7C1370DV25-167BZI is a cutting-edge SRAM chip designed by Infineon Technologies, tailored for applications requiring high-speed, high-capacity storage. This IC features a substantial 18Mbit of parallel SRAM, housed within a compact 165FBGA package, making it an excellent choice for advanced digital systems that demand robust, low-latency memory solutions. The use of this specific model enhances system reliability and performance, which is crucial for B2B customers looking to deploy high-performance products at scale.

CY7C1370DV25-167BZI Features

This SRAM chip boasts a parallel interface, providing rapid access and write times, which is essential for high-speed computing applications. Its 165FBGA packaging is not only space-efficient but also offers improved thermal management and reduced electrical noise, enhancing overall system stability. Furthermore, the chip operates at a clock frequency of 167 MHz, which allows for efficient data handling in rigorous computing environments.

CY7C1370DV25-167BZI Applications

  • Networking Equipment: Utilized in routers and switches, the CY7C1370DV25-167BZI provides the necessary speed and capacity for handling high volumes of data traffic efficiently.
  • High-performance Computing: Serves as a critical component in workstations and servers where quick access to large amounts of data is required for processing complex computations.
  • Telecommunications: Used in telecommunications infrastructure to ensure fast and reliable access to data, essential for real-time communication applications.
  • Video Streaming Devices: Supports high-definition video streaming by facilitating fast data retrieval, crucial for reducing buffer times and enhancing viewer experience.
  • Automotive Electronics: Applied in advanced driver-assistance systems (ADAS) where rapid data processing is essential for real-time decision making.
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