CY7C1370D-200BZI
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- Mfr.Part #
- CY7C1370D-200BZI
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165FBGA
- Stock
- 30,530
- In Stock ：
- 30,530
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Terminal Pitch :
- 1mm
- Number of Ports :
- 4
- Memory Size :
- 18Mb 512K x 36
- Peak Reflow Temperature (Cel) :
- 220
- Number of Pins :
- 165
- Memory Interface :
- Parallel
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Series :
- NoBL™
- Supply Voltage-Min (Vsup) :
- 3.135V
- JESD-609 Code :
- e0
- Access Time :
- 3ns
- Additional Feature :
- PIPELINED ARCHITECTURE
- RoHS Status :
- Non-RoHS Compliant
- Packaging :
- Tray
- Standby Current-Max :
- 0.07A
- Memory Format :
- SRAM
- Sync/Async :
- SYNCHRONOUS
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Pbfree Code :
- No
- Mount :
- Surface Mount
- Density :
- 18 Mb
- Operating Temperature :
- -40°C~85°C TA
- Number of Functions :
- 1
- Published :
- 2011
- Address Bus Width :
- 19b
- Organization :
- 512KX36
- Number of Terminations :
- 165
- Supply Voltage-Max (Vsup) :
- 3.6V
- Mounting Type :
- Surface Mount
- Output Characteristics :
- 3-STATE
- I/O Type :
- COMMON
- Package / Case :
- 165-LBGA
- ECCN Code :
- 3A991.B.2.A
- Voltage - Supply :
- 3.135V~3.6V
- Memory Type :
- Volatile
- Terminal Position :
- BOTTOM
- Operating Supply Voltage :
- 3.3V
- Supply Voltage :
- 3.3V
- Length :
- 15mm
- Lead Free :
- Contains Lead
- Base Part Number :
- CY7C1370
- Word Size :
- 36b
- Nominal Supply Current :
- 300mA
- Clock Frequency :
- 200MHz
- Radiation Hardening :
- No
- Pin Count :
- 165
- Memory Width :
- 36
- Datasheets
- CY7C1370D-200BZI
Memory Infineon Technologies CY7C1370D-200BZI Overview
The Memory Infineon Technologies CY7C1370D-200BZI is a high-performance Integrated Circuit (IC) specifically designed for advanced, high-speed computing applications. This 18Mbit SRAM chip, enclosed in a compact 165FBGA package, offers robust parallel interfaces, making it an ideal solution for achieving fast data throughput and low-latency performance in critical systems. Its ample storage capacity and speed are tailored to support complex processes and multitasking environments that require rapid access to large volumes of temporary data.
CY7C1370D-200BZI Features
This IC from Infineon Technologies incorporates several key features that make it stand out in the memory sector. It provides an 18Mbit storage capacity, facilitating extensive data handling capabilities for demanding applications. The parallel interface ensures high-speed data access, crucial for performance-critical applications. The 165FBGA packaging not only minimizes the footprint on system boards but also enhances thermal management, contributing to the overall reliability and durability of the component.
CY7C1370D-200BZI Applications
- High-performance Computing: Utilized in servers and workstations, the CY7C1370D-200BZI helps manage large datasets efficiently, facilitating fast processing and response times in computing environments.
- Networking Equipment: Applicable in routers, switches, and network controllers, this SRAM improves the handling of high-speed data packets, enhancing overall network throughput and reliability.
- Embedded Systems: Ideal for use in automotive and industrial control systems, where reliable and quick memory access is necessary for real-time processing.
- Telecommunications: Supports the demands of telecommunications infrastructure by providing the necessary speed and capacity for managing extensive data flows and high user loads.
- Gaming Consoles: Enhances gaming experiences by decreasing load times and smoothing gameplay through faster data retrieval and storage.
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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
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