CY7C1370BV25-167AC
- Mfr.Part #
- CY7C1370BV25-167AC
- Manufacturer
- Infineon Technologies
- Package / Case
- 100-LQFP
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 100TQFP
- Stock
- 3,528
- In Stock :
- 3,528
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Width :
- 14mm
- Memory Type :
- Volatile
- JESD-30 Code :
- R-PQFP-G100
- I/O Type :
- COMMON
- ECCN Code :
- 3A991.B.2.A
- JESD-609 Code :
- e0
- Qualification Status :
- Not Qualified
- Height Seated (Max) :
- 1.6mm
- Memory Width :
- 36
- Number of Functions :
- 1
- Standby Current-Max :
- 0.02A
- Pin Count :
- 100
- Supply Current-Max :
- 0.23mA
- Organization :
- 512KX36
- Standby Voltage-Min :
- 2.38V
- Number of Terminations :
- 100
- Memory Interface :
- Parallel
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Mounting Type :
- Surface Mount
- RoHS Status :
- Non-RoHS Compliant
- Lead Free :
- Contains Lead
- Terminal Position :
- QUAD
- Supply Voltage :
- 2.5V
- Memory Density :
- 18874368 bit
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Published :
- 2002
- Voltage - Supply :
- 2.375V~2.625V
- Memory Size :
- 18Mb 512K x 36
- Reach Compliance Code :
- not_compliant
- Supply Voltage-Max (Vsup) :
- 2.625V
- Packaging :
- Tray
- HTS Code :
- 8542.32.00.41
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Output Characteristics :
- 3-STATE
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Surface Mount :
- yes
- Supply Voltage-Min (Vsup) :
- 2.375V
- Power Supplies :
- 2.5V
- Operating Temperature :
- 0°C~70°C TA
- Access Time :
- 3.4ns
- Clock Frequency :
- 167MHz
- Length :
- 20mm
- Additional Feature :
- PIPELINED ARCHITECTURE
- Terminal Pitch :
- 0.65mm
- Base Part Number :
- CY7C1370
- Package / Case :
- 100-LQFP
- Memory Format :
- SRAM
- Datasheets
- CY7C1370BV25-167AC

Memory Infineon Technologies CY7C1370BV25-167AC Overview
The Memory Infineon Technologies CY7C1370BV25-167AC is an advanced SRAM chip featuring a substantial 18Mbit storage capacity, optimized for high-speed performance and reliability. This product, housed in a 100-pin TQFP package, caters specifically to applications requiring rapid access to large volumes of data. The integration of cutting-edge technology by Infineon Technologies ensures low latency and high throughput, making this memory chip an ideal solution for performance-critical applications. Its robust design is tailored to meet the stringent demands of modern electronic systems, providing a reliable and efficient performance that enhances the overall system stability.
CY7C1370BV25-167AC Features
This high-performance IC SRAM from Infineon offers 18Mbit of parallel memory, encapsulated in a compact 100TQFP package. It is designed for high-speed data transactions and is capable of withstanding industrial temperature ranges, ensuring reliability under various operational conditions. The device's architecture facilitates easy integration into a wide range of industrial and commercial applications, providing both versatility and functionality.
CY7C1370BV25-167AC Applications
- Networking Equipment: Utilized in routers and switches to manage data buffers efficiently, enhancing throughput and data integrity in high-speed networks.
- Telecommunications: Supports high-speed data transmission requirements in telecommunications infrastructure, enabling faster signal processing and improved service delivery.
- Automotive Systems: Integral in advanced driver-assistance systems (ADAS) for rapid data access and processing, contributing to enhanced vehicle safety and performance.
- Industrial Automation: Applied in control systems for real-time processing of operational data, facilitating improved response times and accuracy in automated environments.
- Medical Devices: Used in medical imaging systems to handle large data volumes quickly, ensuring timely and accurate diagnostic results.
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