CY7C1370BV25-167AC

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Mfr.Part #
CY7C1370BV25-167AC
Manufacturer
Infineon Technologies
Package / Case
100-LQFP
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 100TQFP
Stock
3,528
In Stock :
3,528

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Width :
14mm
Memory Type :
Volatile
JESD-30 Code :
R-PQFP-G100
I/O Type :
COMMON
ECCN Code :
3A991.B.2.A
JESD-609 Code :
e0
Qualification Status :
Not Qualified
Height Seated (Max) :
1.6mm
Memory Width :
36
Number of Functions :
1
Standby Current-Max :
0.02A
Pin Count :
100
Supply Current-Max :
0.23mA
Organization :
512KX36
Standby Voltage-Min :
2.38V
Number of Terminations :
100
Memory Interface :
Parallel
Terminal Finish :
Tin/Lead (Sn/Pb)
Mounting Type :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Lead Free :
Contains Lead
Terminal Position :
QUAD
Supply Voltage :
2.5V
Memory Density :
18874368 bit
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Published :
2002
Voltage - Supply :
2.375V~2.625V
Memory Size :
18Mb 512K x 36
Reach Compliance Code :
not_compliant
Supply Voltage-Max (Vsup) :
2.625V
Packaging :
Tray
HTS Code :
8542.32.00.41
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Output Characteristics :
3-STATE
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Surface Mount :
yes
Supply Voltage-Min (Vsup) :
2.375V
Power Supplies :
2.5V
Operating Temperature :
0°C~70°C TA
Access Time :
3.4ns
Clock Frequency :
167MHz
Length :
20mm
Additional Feature :
PIPELINED ARCHITECTURE
Terminal Pitch :
0.65mm
Base Part Number :
CY7C1370
Package / Case :
100-LQFP
Memory Format :
SRAM
Introducing Memory Infineon Technologies CY7C1370BV25-167AC from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:100, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Base Part Number:CY7C1370, Package / Case:100-LQFP, CY7C1370BV25-167AC pinout, CY7C1370BV25-167AC datasheet PDF, CY7C1370BV25-167AC amp .Beyond Memory Infineon Technologies CY7C1370BV25-167AC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1370BV25-167AC


Memory Infineon Technologies CY7C1370BV25-167AC Overview

The Memory Infineon Technologies CY7C1370BV25-167AC is an advanced SRAM chip featuring a substantial 18Mbit storage capacity, optimized for high-speed performance and reliability. This product, housed in a 100-pin TQFP package, caters specifically to applications requiring rapid access to large volumes of data. The integration of cutting-edge technology by Infineon Technologies ensures low latency and high throughput, making this memory chip an ideal solution for performance-critical applications. Its robust design is tailored to meet the stringent demands of modern electronic systems, providing a reliable and efficient performance that enhances the overall system stability.

CY7C1370BV25-167AC Features

This high-performance IC SRAM from Infineon offers 18Mbit of parallel memory, encapsulated in a compact 100TQFP package. It is designed for high-speed data transactions and is capable of withstanding industrial temperature ranges, ensuring reliability under various operational conditions. The device's architecture facilitates easy integration into a wide range of industrial and commercial applications, providing both versatility and functionality.

CY7C1370BV25-167AC Applications

  • Networking Equipment: Utilized in routers and switches to manage data buffers efficiently, enhancing throughput and data integrity in high-speed networks.
  • Telecommunications: Supports high-speed data transmission requirements in telecommunications infrastructure, enabling faster signal processing and improved service delivery.
  • Automotive Systems: Integral in advanced driver-assistance systems (ADAS) for rapid data access and processing, contributing to enhanced vehicle safety and performance.
  • Industrial Automation: Applied in control systems for real-time processing of operational data, facilitating improved response times and accuracy in automated environments.
  • Medical Devices: Used in medical imaging systems to handle large data volumes quickly, ensuring timely and accurate diagnostic results.
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