CY7C1364CV33-166AXC

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Mfr.Part #
CY7C1364CV33-166AXC
Manufacturer
Infineon Technologies
Package / Case
100-LQFP
Datasheet
Download
Description
IC SRAM 8MBIT PARALLEL 100TQFP
Stock
25
In Stock :
25

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Terminal Position :
QUAD
Organization :
256KX32
Supply Voltage-Max (Vsup) :
3.6V
JESD-609 Code :
e3
Voltage - Supply :
3.135V~3.6V
Package / Case :
100-LQFP
Published :
2004
Nominal Supply Current :
180mA
Supply Voltage :
3.3V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
8Mb 256K x 32
Height Seated (Max) :
1.6mm
Number of Ports :
4
Memory Type :
Volatile
Packaging :
Tray
Terminal Finish :
Matte Tin (Sn)
Radiation Hardening :
No
Peak Reflow Temperature (Cel) :
260
ECCN Code :
3A991.B.2.A
Word Size :
32b
Address Bus Width :
18b
Terminal Pitch :
0.65mm
Number of Functions :
1
Clock Frequency :
166MHz
Memory Interface :
Parallel
Memory Format :
SRAM
Mounting Type :
Surface Mount
Access Time :
3.5ns
Sync/Async :
SYNCHRONOUS
Number of Terminations :
100
Memory Width :
32
Lead Free :
Lead Free
Number of Pins :
100
Supply Voltage-Min (Vsup) :
3.135V
Operating Temperature :
0°C~70°C TA
RoHS Status :
ROHS3 Compliant
Base Part Number :
CY7C1364
Mount :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
40
Operating Supply Voltage :
3.3V
Length :
20mm
Density :
9 Mb
Introducing Memory Infineon Technologies CY7C1364CV33-166AXC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:100-LQFP, Mounting Type:Surface Mount, Number of Terminations:100, Number of Pins:100, Operating Temperature:0°C~70°C TA, Base Part Number:CY7C1364, CY7C1364CV33-166AXC pinout, CY7C1364CV33-166AXC datasheet PDF, CY7C1364CV33-166AXC amp .Beyond Memory Infineon Technologies CY7C1364CV33-166AXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1364CV33-166AXC


Memory Infineon Technologies CY7C1364CV33-166AXC Overview

The Memory Infineon Technologies CY7C1364CV33-166AXC is a high-performance 8Mbit SRAM chip designed by Infineon Technologies, ideal for applications requiring fast access and high data throughput. This IC employs a parallel interface, offering rapid data transfer rates, which makes it exceptionally suitable for high-speed computing and advanced telecommunications systems. Encased in a compact 100TQFP package, it integrates seamlessly into a variety of industrial designs, making it a versatile choice for engineers looking to enhance system reliability and performance.

CY7C1364CV33-166AXC Features

This SRAM chip boasts several features that make it an optimal solution for demanding applications. It offers a large 8MB memory capacity, allowing ample space for data storage and retrieval. The parallel communication interface ensures that data handling is both efficient and rapid, crucial for systems requiring quick response times. Additionally, the 100TQFP packaging not only minimizes space on printed circuit boards but also aids in efficient thermal management.

CY7C1364CV33-166AXC Applications

  • Advanced Computing Systems: Utilized for its high-speed data access and large storage capacity, this SRAM is perfect for server farms and high-performance computing scenarios where speed and reliability are paramount.
  • Telecommunication Equipment: Supports complex telecommunications systems by providing the necessary speed and bandwidth to handle large volumes of data transmissions and storage.
  • Networking Hardware: Ideal for routers and switches, where quick data buffering is necessary to maintain high throughput and low latency in network communications.
  • Industrial Automation: Employed in industrial control systems, the CY7C1364CV33-166AXC ensures reliable and fast data handling to manage and monitor automated processes efficiently.
  • Aerospace and Defense: Used in aerospace applications where reliability and data integrity are crucial under extreme conditions, supporting critical mission operations.
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