CY7C1361C-100AXC
- Mfr.Part #
- CY7C1361C-100AXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 100-LQFP
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 100TQFP
- Stock
- 32,767
- In Stock :
- 32,767
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Supply Voltage :
- 3.3V
- Mount :
- Surface Mount
- Terminal Finish :
- Matte Tin (Sn)
- Radiation Hardening :
- No
- Nominal Supply Current :
- 180mA
- Memory Size :
- 9Mb 256K x 36
- Peak Reflow Temperature (Cel) :
- 260
- Number of Terminations :
- 100
- Width :
- 14mm
- Factory Lead Time :
- 6 Weeks
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Address Bus Width :
- 18b
- Lead Free :
- Lead Free
- Supply Voltage-Min (Vsup) :
- 3.135V
- Number of Pins :
- 100
- Voltage - Supply :
- 3.135V~3.6V
- Base Part Number :
- CY7C1361
- ECCN Code :
- 3A991.B.2.A
- Operating Temperature :
- 0°C~70°C TA
- Length :
- 20mm
- Terminal Position :
- QUAD
- Pin Count :
- 100
- Access Time :
- 8.5ns
- Density :
- 9 Mb
- Memory Interface :
- Parallel
- Pbfree Code :
- yes
- Number of Ports :
- 4
- Additional Feature :
- FLOW-THROUGH ARCHITECTURE
- Time@Peak Reflow Temperature-Max (s) :
- 20
- I/O Type :
- COMMON
- Memory Type :
- Volatile
- Supply Voltage-Max (Vsup) :
- 3.6V
- Number of Functions :
- 1
- Memory Format :
- SRAM
- Organization :
- 256KX36
- Sync/Async :
- SYNCHRONOUS
- Operating Supply Voltage :
- 3.3V
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Surface Mount
- Word Size :
- 36b
- Published :
- 2003
- JESD-609 Code :
- e3
- Height Seated (Max) :
- 1.6mm
- Package / Case :
- 100-LQFP
- Clock Frequency :
- 100MHz
- Packaging :
- Tray
- Terminal Pitch :
- 0.65mm
- Output Characteristics :
- 3-STATE
- Datasheets
- CY7C1361C-100AXC

Memory Infineon Technologies CY7C1361C-100AXC Overview
The Memory Infineon Technologies CY7C1361C-100AXC represents a high-performance, 9Mbit SRAM module designed for advanced, high-speed computing systems. This product, housed in a compact 100TQFP package, is engineered by Infineon Technologies, a leader in semiconductor solutions. The CY7C1361C-100AXC is optimized for applications requiring fast access and high reliability, making it an ideal choice for demanding memory storage environments. Its robust design ensures that it can meet the stringent requirements of industrial, automotive, and communication sectors, where performance and durability are paramount.
CY7C1361C-100AXC Features
The CY7C1361C-100AXC offers several distinct features that make it stand out. Firstly, its large 9Mbit capacity allows for substantial data storage within a single chip, facilitating efficient data management and retrieval. This SRAM chip operates in a parallel interface, ensuring high-speed data transfer rates that are crucial for performance-critical applications. Additionally, its 100TQFP packaging not only provides a space-efficient footprint but also ensures enhanced thermal management and reliability under a variety of environmental conditions.
CY7C1361C-100AXC Applications
- Networking Equipment: Utilized in routers and switches to manage data flow efficiently, ensuring high-speed data processing and reliability in network traffic management.
- Automotive Systems: Employs in advanced driver-assistance systems (ADAS) to handle rapid sensor data processing, contributing to safer driving through faster response times and reliable operation.
- Industrial Automation: Integrated in PLCs and industrial PCs to optimize the handling and processing of complex datasets, enhancing the efficiency and reliability of automated systems.
- Telecommunications: Used in telecom infrastructure to facilitate fast and reliable data buffering, ensuring uninterrupted service and real-time communication capabilities.
- Consumer Electronics: Applied in high-performance gaming consoles and computers to boost processing speeds and enhance user experiences through quick data access and minimal latency.
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