CY7C1360C-200BGC
- Mfr.Part #
- CY7C1360C-200BGC
- Manufacturer
- Infineon Technologies
- Package / Case
- 119-BGA
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 119PBGA
- Stock
- 8,045
- In Stock :
- 8,045
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Word Size :
- 36b
- Supply Voltage :
- 3.3V
- Memory Interface :
- Parallel
- Number of Functions :
- 1
- Clock Frequency :
- 200MHz
- Nominal Supply Current :
- 220mA
- Number of Terminations :
- 119
- Number of Ports :
- 4
- Memory Size :
- 9Mb 256K x 36
- Mount :
- Surface Mount
- Base Part Number :
- CY7C1360
- Lead Free :
- Contains Lead
- Peak Reflow Temperature (Cel) :
- 220
- Memory Type :
- Volatile
- Access Time :
- 3ns
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 3.135V~3.6V
- Operating Supply Voltage :
- 3.3V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- I/O Type :
- COMMON
- Sync/Async :
- SYNCHRONOUS
- Memory Format :
- SRAM
- Terminal Pitch :
- 1.27mm
- Address Bus Width :
- 18b
- Terminal Position :
- BOTTOM
- Package / Case :
- 119-BGA
- Operating Temperature :
- 0°C~70°C TA
- Length :
- 22mm
- Time@Peak Reflow Temperature-Max (s) :
- 20
- ECCN Code :
- 3A991.B.2.A
- Additional Feature :
- PIPELINED ARCHITECTURE
- RoHS Status :
- Non-RoHS Compliant
- Organization :
- 256KX36
- Supply Voltage-Max (Vsup) :
- 3.6V
- Pin Count :
- 119
- Number of Pins :
- 119
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Density :
- 9 Mb
- Supply Voltage-Min (Vsup) :
- 3.135V
- JESD-609 Code :
- e0
- Packaging :
- Tray
- Output Characteristics :
- 3-STATE
- Radiation Hardening :
- No
- Memory Width :
- 36
- Factory Lead Time :
- 6 Weeks
- Pbfree Code :
- No
- Datasheets
- CY7C1360C-200BGC

Memory Infineon Technologies CY7C1360C-200BGC Overview
The Memory Infineon Technologies CY7C1360C-200BGC is a high-performance, 9Mbit static random-access memory (SRAM) component designed for rapid data access and high reliability. Manufactured by Infineon Technologies, this IC is housed in a compact 119-pin PBGA (plastic ball grid array) package, making it ideal for applications where space is at a premium but performance cannot be compromised. The CY7C1360C-200BGC offers a robust parallel interface, facilitating faster and more efficient data handling capabilities crucial for modern high-speed computing and processing tasks.
CY7C1360C-200BGC Features
This SRAM device stands out with its large 9MB capacity, providing ample space for temporary data storage in a wide range of computing environments. It operates at a speed of 200MHz, which enables quick access to data, enhancing overall system performance. The parallel interface of the CY7C1360C-200BGC ensures compatibility with a variety of microprocessors and digital signal processors, making it a versatile choice for numerous high-speed computing applications.
CY7C1360C-200BGC Applications
- Networking Equipment: Used in routers, switches, and other networking hardware to manage data flow efficiently.
- Telecommunications Systems: Employs high-speed SRAM to handle quick data transactions required in telecommunication infrastructures.
- High-Performance Computing: Ideal for applications requiring fast and reliable data access, such as in supercomputing and research facilities.
- Automotive Electronics: Supports advanced driver-assistance systems (ADAS) where rapid data processing is crucial.
- Industrial Automation: Used in PLCs and other industrial control systems to enhance process control and machine-to-machine communication.
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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
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