CY7C1354C-166BZC
- Mfr.Part #
- CY7C1354C-166BZC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 165FBGA
- Stock
- 32,607
- In Stock :
- 32,607
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Memory Width :
- 36
- Mounting Type :
- Surface Mount
- Mount :
- Surface Mount
- Memory Size :
- 9Mb 256K x 36
- Access Time :
- 3.5ns
- Series :
- NoBL™
- Peak Reflow Temperature (Cel) :
- 220
- Nominal Supply Current :
- 180mA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Output Characteristics :
- 3-STATE
- Supply Voltage-Max (Vsup) :
- 3.6V
- Supply Voltage :
- 3.3V
- Number of Ports :
- 4
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Reach Compliance Code :
- not_compliant
- Number of Pins :
- 165
- Package / Case :
- 165-LBGA
- Base Part Number :
- CY7C1354
- Terminal Pitch :
- 1mm
- Length :
- 15mm
- Organization :
- 256KX36
- Supply Voltage-Min (Vsup) :
- 3.135V
- Word Size :
- 36b
- Pin Count :
- 165
- Published :
- 2004
- RoHS Status :
- Non-RoHS Compliant
- Qualification Status :
- Not Qualified
- Operating Temperature :
- 0°C~70°C TA
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Address Bus Width :
- 18b
- Additional Feature :
- PIPELINED ARCHITECTURE
- I/O Type :
- COMMON
- Operating Supply Voltage :
- 3.3V
- Number of Terminations :
- 165
- ECCN Code :
- 3A991.B.2.A
- Packaging :
- Tray
- Density :
- 9 Mb
- Sync/Async :
- SYNCHRONOUS
- Terminal Position :
- BOTTOM
- Voltage - Supply :
- 3.135V~3.6V
- Number of Functions :
- 1
- Memory Type :
- Volatile
- JESD-609 Code :
- e0
- Memory Interface :
- Parallel
- Memory Format :
- SRAM
- Clock Frequency :
- 166MHz
- Datasheets
- CY7C1354C-166BZC

Memory Infineon Technologies CY7C1354C-166BZC Overview
The Memory Infineon Technologies CY7C1354C-166BZC is a high-performance, 9Mbit SRAM chip designed to meet the demanding requirements of high-speed data processing and storage applications. This IC utilizes a parallel interface, offering rapid access times housed within a compact 165FBGA package. It is engineered to provide reliable, high-speed operation, making it an ideal choice for enhancing the performance and efficiency of advanced digital systems. Its robust design and cutting-edge technology make the CY7C1354C-166BZC a standout component for businesses looking to upgrade their electronic systems.
CY7C1354C-166BZC Features
The CY7C1354C-166BZC SRAM features include a large 9Mbit capacity and fast access time, integrated within a small 165-pin Fine Ball Grid Array (FBGA) package for space efficiency. It supports a parallel interface, facilitating high-speed data transfers which are essential for performance-critical applications. The reliability of the CY7C1354C-166BZC is enhanced by Infineon Technologies' advanced manufacturing processes, ensuring high durability and consistent performance under varying conditions.
CY7C1354C-166BZC Applications
- Networking Equipment: Utilized in routers and switches for fast data buffering, enhancing throughput and performance.
- Telecommunications Systems: Provides high-speed data access for telecommunications infrastructure, supporting enhanced data transmission capabilities.
- Industrial Automation: Ideal for use in complex industrial control systems where quick access to large amounts of data is necessary for real-time processing.
- High-Performance Computing: Serves as temporary storage for large datasets in supercomputing environments, speeding up data access and processing times.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to rapidly process large volumes of data from sensors and cameras for real-time decision making.
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