CY7C1320JV18-300BZXC

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Mfr.Part #
CY7C1320JV18-300BZXC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
2
In Stock :
2

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Operating Temperature :
0°C~70°C TA
RoHS Status :
ROHS3 Compliant
Supply Current-Max :
0.73mA
Surface Mount :
yes
Output Characteristics :
3-STATE
Memory Format :
SRAM
Standby Current-Max :
0.295A
Packaging :
Tray
Operating Supply Voltage :
1.8V
Terminal Position :
BOTTOM
Package / Case :
165-LBGA
Additional Feature :
PIPELINED ARCHITECTURE
Mounting Type :
Surface Mount
Number of Ports :
1
Access Time :
450 ps
Memory Width :
36
Pin Count :
165
Memory Type :
Volatile
Published :
2003
Address Bus Width :
19b
Number of Terminations :
165
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
I/O Type :
COMMON
Number of Pins :
165
Memory Size :
18Mb 512K x 36
Radiation Hardening :
No
Density :
18 Mb
Number of Functions :
1
Supply Voltage :
1.8V
Clock Frequency :
300MHz
Memory Interface :
Parallel
Base Part Number :
CY7C1320
JESD-609 Code :
e1
Voltage - Supply :
1.7V~1.9V
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Introducing Memory Infineon Technologies CY7C1320JV18-300BZXC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Package / Case:165-LBGA, Mounting Type:Surface Mount, Number of Terminations:165, Number of Pins:165, Base Part Number:CY7C1320, CY7C1320JV18-300BZXC pinout, CY7C1320JV18-300BZXC datasheet PDF, CY7C1320JV18-300BZXC amp .Beyond Memory Infineon Technologies CY7C1320JV18-300BZXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1320JV18-300BZXC


Memory Infineon Technologies CY7C1320JV18-300BZXC Overview

The Memory Infineon Technologies CY7C1320JV18-300BZXC is a high-performance 18Mbit SRAM module designed by Infineon Technologies. This IC offers robust parallel interfaces in a compact 165FBGA package, catering specifically to applications that require fast access times and high bandwidth. Its reliability and durability are enhanced by advanced fabrication technology, making it a top choice for industrial and high-speed computing environments. The utilization of this SRAM module enables efficient handling of large data buffers and temporary storage applications, ideal for demanding electronic systems.

CY7C1320JV18-300BZXC Features

The CY7C1320JV18-300BZXC boasts several key features that make it a standout choice for developers and engineers. It operates with a speed of 300 MHz, providing high throughput for data-intensive applications. Its parallel interface ensures compatibility with a broad range of existing technologies and legacy systems, facilitating easy integration. The module's low-latency design is critical for real-time applications, where rapid access to stored data is paramount.

CY7C1320JV18-300BZXC Applications

  • Networking Equipment: Utilized in routers and switches for packet buffering, ensuring swift data flow and reduced latency in communication infrastructures.
  • High-performance Computing: Acts as a fast-access scratchpad memory in servers and supercomputers, enabling quick processing of complex computations and enhancing overall system efficiency.
  • Automotive Electronics: Employed in advanced driver-assistance systems (ADAS) to store and manage real-time sensor data, crucial for immediate decision-making and vehicle safety enhancements.
  • Industrial Automation: Supports automation controllers and real-time processing units in managing process control tasks, thereby optimizing operational flow and minimizing system response times.
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Shipping Cost

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