CY7C1320JV18-250BZXI

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Mfr.Part #
CY7C1320JV18-250BZXI
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
11,743
In Stock :
11,743

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Memory Width :
36
Height Seated (Max) :
1.4mm
Additional Feature :
PIPELINED ARCHITECTURE
Package / Case :
165-LBGA
Qualification Status :
COMMERCIAL
Terminal Position :
BOTTOM
Mounting Type :
Surface Mount
Pin Count :
165
Supply Voltage :
1.8V
Memory Format :
SRAM
Access Time (Max) :
0.45 ns
Memory Size :
18Mb 512K x 36
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
ROHS3 Compliant
Number of Functions :
1
Voltage - Supply :
1.7V~1.9V
Terminal Finish :
NOT SPECIFIED
Packaging :
Tray
Terminal Pitch :
1mm
Memory Density :
18874368 bit
Supply Voltage-Min (Vsup) :
1.7V
Length :
15mm
JESD-30 Code :
R-PBGA-B165
Organization :
512KX36
Width :
13mm
Memory Interface :
Parallel
Supply Voltage-Max (Vsup) :
1.9V
Reach Compliance Code :
Unknown
Surface Mount :
yes
Number of Terminations :
165
Memory Type :
Volatile
Operating Temperature :
-40°C~85°C TA
Clock Frequency :
250MHz
Introducing Memory Infineon Technologies CY7C1320JV18-250BZXI from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Mounting Type:Surface Mount, Number of Terminations:165, Operating Temperature:-40°C~85°C TA, CY7C1320JV18-250BZXI pinout, CY7C1320JV18-250BZXI datasheet PDF, CY7C1320JV18-250BZXI amp .Beyond Memory Infineon Technologies CY7C1320JV18-250BZXI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1320JV18-250BZXI


Memory Infineon Technologies CY7C1320JV18-250BZXI Overview

The Memory Infineon Technologies CY7C1320JV18-250BZXI is a high-performance IC SRAM offering an impressive 18Mbit storage capacity, designed for demanding parallel processing environments. Engineered by Infineon Technologies, a leader in semiconductor innovation, this product ensures reliable high-speed data access and storage. The CY7C1320JV18-250BZXI is housed in a compact 165FBGA package, making it ideal for applications where space is at a premium but performance cannot be compromised. This SRAM module is particularly suited for B2B customers looking to integrate robust memory solutions into their advanced digital systems, facilitating enhanced system performance and reliability.

CY7C1320JV18-250BZXI Features

This 18Mbit SRAM features a parallel interface, allowing for quick data transfer rates that are essential in high-speed computing and real-time processing applications. The 165FBGA packaging not only reduces the footprint but also enhances the thermal management and reliability of the memory module. Its robust design ensures stable operation under various industrial conditions, making it an excellent choice for sophisticated electronics that require durable and dependable memory storage solutions.

CY7C1320JV18-250BZXI Applications

  • Advanced Networking Equipment: Utilizes high-speed SRAM for buffering and caching to enhance network performance and manageability.
  • Telecommunications Infrastructure: Supports high data throughput requirements in telecom hardware, facilitating faster communication protocols.
  • High-Performance Computing (HPC) Systems: Provides rapid access memory that is crucial for complex computations and processing in supercomputers and data centers.
  • Automotive Electronics: Enhances functionality in automotive systems by providing reliable, fast memory for navigation and driver assistance systems.
  • Aerospace and Defense Systems: Offers dependable and secure memory storage necessary for critical aerospace and defense applications, ensuring performance in extreme conditions.
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