CY7C1315CV18-200BZC
- Mfr.Part #
- CY7C1315CV18-200BZC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165FBGA
- Stock
- 36,899
- In Stock :
- 36,899
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Height Seated (Max) :
- 1.4mm
- RoHS Status :
- Non-RoHS Compliant
- Operating Temperature :
- 0°C~70°C TA
- Terminal Finish :
- NOT SPECIFIED
- Reach Compliance Code :
- Unknown
- Pin Count :
- 165
- Length :
- 15mm
- Memory Type :
- Volatile
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage-Max (Vsup) :
- 1.9V
- Voltage - Supply :
- 1.7V~1.9V
- Organization :
- 512KX36
- Memory Size :
- 18Mb 512K x 36
- Terminal Pitch :
- 1mm
- Surface Mount :
- yes
- Supply Voltage-Min (Vsup) :
- 1.7V
- Clock Frequency :
- 200MHz
- Package / Case :
- 165-LBGA
- Number of Functions :
- 1
- Memory Interface :
- Parallel
- Additional Feature :
- PIPELINED ARCHITECTURE
- Memory Format :
- SRAM
- Access Time (Max) :
- 0.45 ns
- Qualification Status :
- COMMERCIAL
- Number of Terminations :
- 165
- Width :
- 13mm
- Packaging :
- Tray
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 1.8V
- JESD-30 Code :
- R-PBGA-B165
- Memory Width :
- 36
- Mounting Type :
- Surface Mount
- Memory Density :
- 18874368 bit
- Datasheets
- CY7C1315CV18-200BZC

Memory Infineon Technologies CY7C1315CV18-200BZC Overview
The Memory Infineon Technologies CY7C1315CV18-200BZC is a high-performance, 18Mbit SRAM chip designed for demanding applications that require rapid access to large volumes of data. Manufactured by Infineon Technologies, this memory module utilizes a parallel interface and is packaged in a compact 165FBGA format, making it ideal for high-speed data buffering and storage operations. Its robust design and advanced technology serve as a reliable solution for enhancing system performance across a variety of industrial applications. By integrating this SRAM into their systems, B2B customers can expect improved device reliability and enhanced operational efficiencies.
CY7C1315CV18-200BZC Features
This SRAM module features a large 18Mbit capacity with a parallel interface that facilitates fast and efficient data handling capabilities. The chip is housed in a 165-pin FBGA (Fine-Pitch Ball Grid Array) package that ensures a minimal footprint on the PCB while providing robust protection for the integrated circuits within. The memory operates at a speed of 200MHz, which enables high-speed data transfers and reduces system latency. This combination of features makes it an excellent choice for applications requiring high speed, large memory capacity, and compact size.
CY7C1315CV18-200BZC Applications
- Networking Equipment: Utilized in routers, switches, and other networking hardware for packet buffering and data queue management, ensuring smooth data flow and reduced latency.
- Telecommunications Systems: Critical for high-speed telecom infrastructures, aiding in the rapid handling and processing of information, enhancing both system reliability and performance.
- Industrial Automation: Supports automation systems by providing fast data access required for real-time processing and control, thus improving response times and operational accuracy.
- Medical Equipment: Used in medical imaging systems, where rapid data processing is essential for generating high-resolution images in real time.
- Automotive Technology: Employs in advanced driver-assistance systems (ADAS) to process large amounts of data from vehicle sensors, improving reaction times and safety features.
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