CY7C1315CV18-200BZC

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Mfr.Part #
CY7C1315CV18-200BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
36,899
In Stock :
36,899

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Height Seated (Max) :
1.4mm
RoHS Status :
Non-RoHS Compliant
Operating Temperature :
0°C~70°C TA
Terminal Finish :
NOT SPECIFIED
Reach Compliance Code :
Unknown
Pin Count :
165
Length :
15mm
Memory Type :
Volatile
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage-Max (Vsup) :
1.9V
Voltage - Supply :
1.7V~1.9V
Organization :
512KX36
Memory Size :
18Mb 512K x 36
Terminal Pitch :
1mm
Surface Mount :
yes
Supply Voltage-Min (Vsup) :
1.7V
Clock Frequency :
200MHz
Package / Case :
165-LBGA
Number of Functions :
1
Memory Interface :
Parallel
Additional Feature :
PIPELINED ARCHITECTURE
Memory Format :
SRAM
Access Time (Max) :
0.45 ns
Qualification Status :
COMMERCIAL
Number of Terminations :
165
Width :
13mm
Packaging :
Tray
Terminal Position :
BOTTOM
Supply Voltage :
1.8V
JESD-30 Code :
R-PBGA-B165
Memory Width :
36
Mounting Type :
Surface Mount
Memory Density :
18874368 bit
Introducing Memory Infineon Technologies CY7C1315CV18-200BZC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Package / Case:165-LBGA, Number of Terminations:165, Mounting Type:Surface Mount, CY7C1315CV18-200BZC pinout, CY7C1315CV18-200BZC datasheet PDF, CY7C1315CV18-200BZC amp .Beyond Memory Infineon Technologies CY7C1315CV18-200BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1315CV18-200BZC


Memory Infineon Technologies CY7C1315CV18-200BZC Overview

The Memory Infineon Technologies CY7C1315CV18-200BZC is a high-performance, 18Mbit SRAM chip designed for demanding applications that require rapid access to large volumes of data. Manufactured by Infineon Technologies, this memory module utilizes a parallel interface and is packaged in a compact 165FBGA format, making it ideal for high-speed data buffering and storage operations. Its robust design and advanced technology serve as a reliable solution for enhancing system performance across a variety of industrial applications. By integrating this SRAM into their systems, B2B customers can expect improved device reliability and enhanced operational efficiencies.

CY7C1315CV18-200BZC Features

This SRAM module features a large 18Mbit capacity with a parallel interface that facilitates fast and efficient data handling capabilities. The chip is housed in a 165-pin FBGA (Fine-Pitch Ball Grid Array) package that ensures a minimal footprint on the PCB while providing robust protection for the integrated circuits within. The memory operates at a speed of 200MHz, which enables high-speed data transfers and reduces system latency. This combination of features makes it an excellent choice for applications requiring high speed, large memory capacity, and compact size.

CY7C1315CV18-200BZC Applications

  • Networking Equipment: Utilized in routers, switches, and other networking hardware for packet buffering and data queue management, ensuring smooth data flow and reduced latency.
  • Telecommunications Systems: Critical for high-speed telecom infrastructures, aiding in the rapid handling and processing of information, enhancing both system reliability and performance.
  • Industrial Automation: Supports automation systems by providing fast data access required for real-time processing and control, thus improving response times and operational accuracy.
  • Medical Equipment: Used in medical imaging systems, where rapid data processing is essential for generating high-resolution images in real time.
  • Automotive Technology: Employs in advanced driver-assistance systems (ADAS) to process large amounts of data from vehicle sensors, improving reaction times and safety features.
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