CY7C1315BV18-200BZC

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Mfr.Part #
CY7C1315BV18-200BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
40,796
In Stock :
40,796

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Number of Pins :
165
Mounting Type :
Surface Mount
Terminal Position :
BOTTOM
Operating Temperature :
0°C~70°C TA
Packaging :
Tray
Access Time :
450 ps
Supply Voltage-Min (Vsup) :
1.7V
Peak Reflow Temperature (Cel) :
220
Memory Type :
Volatile
Address Bus Width :
19b
Supply Voltage-Max (Vsup) :
1.9V
Sync/Async :
SYNCHRONOUS
Word Size :
36b
Memory Width :
36
Terminal Finish :
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Functions :
1
Terminal Pitch :
1mm
Memory Interface :
Parallel
Memory Format :
SRAM
I/O Type :
Separate
Length :
15mm
Reach Compliance Code :
not_compliant
Voltage - Supply :
1.7V~1.9V
Memory Size :
18Mb 512K x 36
Additional Feature :
PIPELINED ARCHITECTURE
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Published :
2003
Base Part Number :
CY7C1315
RoHS Status :
Non-RoHS Compliant
Pin Count :
165
Clock Frequency :
200MHz
JESD-609 Code :
e0
Output Characteristics :
3-STATE
Height Seated (Max) :
1.4mm
Supply Voltage :
1.8V
Mount :
Surface Mount
Number of Terminations :
165
Nominal Supply Current :
450mA
Package / Case :
165-LBGA
Qualification Status :
Not Qualified
Number of Ports :
2
Operating Supply Voltage :
1.8V
Density :
18 Mb
Standby Voltage-Min :
1.7V
Introducing Memory Infineon Technologies CY7C1315BV18-200BZC from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:165, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Base Part Number:CY7C1315, Number of Terminations:165, Package / Case:165-LBGA, CY7C1315BV18-200BZC pinout, CY7C1315BV18-200BZC datasheet PDF, CY7C1315BV18-200BZC amp .Beyond Memory Infineon Technologies CY7C1315BV18-200BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1315BV18-200BZC


Memory Infineon Technologies CY7C1315BV18-200BZC Overview

The Memory Infineon Technologies CY7C1315BV18-200BZC is a high-performance, 18Mbit SRAM module crafted by the esteemed Infineon Technologies. This IC is designed to meet the demanding requirements of high-speed data storage and throughput necessary for advanced computing and networking systems. Encased in a compact 165FBGA package, this parallel interface SRAM offers robust data integrity and speed, ideal for applications requiring rapid access and high reliability. Its architecture is tailored to enhance system performance, making it a pivotal component for manufacturers aiming to leverage speed and durability in their systems.

CY7C1315BV18-200BZC Features

This SRAM unit boasts several key features that make it a standout choice for high-performance electronics. Notably, it offers a large 18Mbit capacity paired with a quick 200 MHz clock speed, enabling efficient handling of large volumes of data at high speeds. The 165FBGA packaging not only ensures a minimal footprint on system boards but also aids in better heat dissipation, contributing to the overall reliability and longevity of the module. Additionally, the parallel interface facilitates straightforward integration into existing architectures, making this IC an excellent choice for system upgrades or new designs seeking robust data management solutions.

CY7C1315BV18-200BZC Applications

  • High-Speed Networking Equipment: Ideal for use in routers, switches, and other networking devices, where rapid data access and integrity are critical for efficient data flow and system reliability.
  • Advanced Computing Systems: Supports complex computations required in high-performance computers and servers, facilitating faster processing and improved system responsiveness.
  • Real-Time Data Acquisition Systems: Provides the necessary speed and capacity for systems capturing real-time data in scientific and industrial environments, ensuring quick processing and minimal data loss.
  • Telecommunication Infrastructure: Enhances telecommunications systems with its high data integrity and access speeds, crucial for managing and routing vast amounts of data over networks.
  • Automotive Electronics: Can be employed in advanced automotive systems, where durability and dependability of data storage are essential for vehicle safety and functionality.
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